Freescale Semiconductor *KE02 Series, Technical Data Manual

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Table of Contents
1 Ordering parts........................................................................... 4
1.1 Determining valid orderable parts......................................4
2 Part identification...................................................................... 4
2.1 Description.........................................................................4
2.2 Format............................................................................... 4
2.3 Fields.................................................................................4
2.4 Example............................................................................ 5
3 Parameter classification............................................................5
4 Ratings......................................................................................6
4.1 Thermal handling ratings...................................................6
4.2 Moisture handling ratings.................................................. 6
4.3 ESD handling ratings.........................................................6
4.4 Voltage and current operating ratings............................... 7
5 General..................................................................................... 7
5.1 Nonswitching electrical specifications............................... 7
5.1.1 DC characteristics................................................. 7
5.1.2 Supply current characteristics............................... 14
5.1.3 EMC performance................................................. 15
5.2 Switching specifications.....................................................16
5.2.1 Control timing........................................................ 16
5.2.2 FTM module timing............................................... 17
5.3 Thermal specifications.......................................................18
5.3.1 Thermal operating requirements........................... 18
5.3.2 Thermal characteristics......................................... 18
6 Peripheral operating requirements and behaviors.................... 20
6.1 Core modules.................................................................... 20
6.1.1 SWD electricals ....................................................20
6.2 External oscillator (OSC) and ICS characteristics............. 21
6.3 NVM specifications............................................................23
6.4 Analog............................................................................... 24
6.4.1 ADC characteristics...............................................24
6.4.2 Analog comparator (ACMP) electricals................. 27
6.5 Communication interfaces.................................................27
6.5.1 SPI switching specifications.................................. 27
7 Dimensions............................................................................... 30
7.1 Obtaining package dimensions......................................... 30
8 Pinout........................................................................................31
8.1 Signal multiplexing and pin assignments...........................31
8.2 Device pin assignment...................................................... 33
9 Revision history.........................................................................35
KE02 Sub-Family Data Sheet, Rev4, 10/2014.
Freescale Semiconductor, Inc. 3