Freescale Semiconductor *KE02 Series, Technical Data Manual

Page: 15 / 37

Table 5. Supply current characteristics (continued)
C Parameter Symbol Core/Bus
Freq
V
DD
(V) Typical
1
Max
2
Unit Temp
C ADC adder to Stop
ADLPC = 1
ADLSMP = 1
ADCO = 1
MODE = 10B
ADICLK = 11B
— — 5 86 (64-, 44-
pin
packages)
42 (32-pin
package)
— µA –40 to 105 °C
C 3 82 (64-, 44-
pin
packages)
41 (32-pin
package)
—
C ACMP adder to Stop — — 5 12 — µA –40 to 105 °C
C 3 12 —
C LVD adder to stop
4
— — 5 128 — µA –40 to 105 °C
C 3 124 —
1. Data in Typical column was characterized at 5.0 V, 25 °C or is typical recommended value.
2. The Max current is observed at high temperature of 105 °C.
3. RTC adder causes I
DD
to increase typically by less than 1 µA; RTC clock source is 1 kHz LPO clock.
4. LVD is periodically woken up from Stop by 5% duty cycle. The period is equal to or less than 2 ms.
5.1.3 EMC performance
Electromagnetic compatibility (EMC) performance is highly dependent on the
environment in which the MCU resides. Board design and layout, circuit topology
choices, location and characteristics of external components as well as MCU software
operation play a significant role in EMC performance. The system designer must consult
the following Freescale applications notes, available on
freescale.com
for advice and
guidance specifically targeted at optimizing EMC performance.
• AN2321: Designing for Board Level Electromagnetic Compatibility
• AN1050: Designing for Electromagnetic Compatibility (EMC) with HCMOS
Microcontrollers
• AN1263: Designing for Electromagnetic Compatibility with Single-Chip
Microcontrollers
• AN2764: Improving the Transient Immunity Performance of Microcontroller-Based
Applications
• AN1259: System Design and Layout Techniques for Noise Reduction in MCU-
Based Systems
Nonswitching electrical specifications
KE02 Sub-Family Data Sheet, Rev4, 10/2014.
Freescale Semiconductor, Inc. 15