FINEPLACER
®
lambda
Rev-Nr. 1.1
5
Optional accessories include special optics for positioning large fine pitch devices on
their substrates and high magnification systems for observing chip bonding. All state
of the art bonding technologies can be performed, such as thermocompression,
ultrasonic/thermosonic bonding, ACF bonding, UV cure and bonding of C4 chips. Due
to the modular system, the necessary configuration may easily be optimized,
corresponding to your individual requirements. As every FINEPLACER
®
, the lambda
allows cost effective and safe manual component placement and bonding at one
work station and in the same operation.
