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CPC1302 User Manual

 

0-23 

Description of operation of CPC1302 major components

 

CPC1302

 

 

 

 

 

 

 

GPIO port (8 I/O channels)

 

GPIO port is used in FPGA. Is designed for input of 4 and output of 4 logical signals. 

 

 

Sensors

 

Digital temperature sensor of CPU (integrated in СPU), dual-zone temperature sensor LM95235 
is connected to SMBUS. Monitor of 7 power supply voltages (12V, 5V, 3.3V, 1.5V, 1.05V, 1.34V, 
VCPU) AMC80AIPW is connected to SMBUS. 

 

 

FGA Xilinx Spartan-6

 

Used for implementation of SPI, I2C interfaces, GPIO ports, Watchdog-timer, diagnostics 
LED\start and control of power supply modes. 

 

 

WDT

 

The module uses one hardware watchdog timer with modifiable actuation interval from 
1 µsec up to 10 minutes, is implemented in FPGA. 

 

 

 

2.3  Connectors COM Express A-B, C-D

 

 

CPC1302 is equipped with the standard COM Express connectors (see Fig. 2-2), using which 

CPC1302  is connecting with the carrier-board.  Purpose of the contacts is specified in the Table A-
1:  Purpose of COM Express connector contacts. 

 

 

 

2.4 

Possible PCIe х16 Gen3 configuration options

 

 

 

Table 2-1: PC

Ie х16 Gen3 configurations

 

 

The  configuration  is  set  in  BIOS  Setup.  Switching  to  the  Reverse  mode 

–  over  the  signal 

PEG_LANE_RV# from COM Express connector. 

Summary of Contents for CPC1302

Page 1: ... CPC1302 CPU Module User Manual IMES 467444 083 UM August 2017 Version 1 01 ...

Page 2: ...r board Adlink Express BASE6 Subsection 3 6 was added with clarification on fastening the module to Adlink Express BASE6 board Subsection 4 1 has an adjustment of BIOS update text CPC1302 May 2017 Contact Information Fastwel Co Ltd Fastwel Corporation US Address 108 Profsoyuznaya st Moscow 117437 Russian Federation 6108 Avenida Encinas Suite B Carlsbad CA92011 Tel 7 495 232 1681 Tel 1 858 488 3663...

Page 3: ...2 Power supply requirement 14 1 5 3 Consumption currents of the modules 14 1 6 Resistance to climatic effects 15 1 7 Resistance to mechanical effects 15 1 8 Weight and dimensions characteristics module and packaging 15 1 8 1 Weight and dimensions of additional complete sets for heat removal 16 1 9 MTBF 17 2 Description of operation of CPC1302 major components 18 2 1 Location of main components 18 ...

Page 4: ...f additional complete sets for heat removal 16 Table 1 10 Weight and dimensions of additional complete sets for heat removal 16 Table 1 11 MTBF 17 Table 2 1 Possible PCIe х16 Gen3 configuration options 23 Table 2 2 Addresses of devices on SMBus 24 Table 3 1 Reset of BIOS Setup settings of CPC1302 using XP1 switch 33 Table 3 2 Description of CPC1302 indicators 33 Table 3 3 Description of HL3 indica...

Page 5: ...ark of Xerox Corporation IEEE is a registered trademark of the Institute of Electrical and Electronics Engineers Inc Microsoft is a trademark of the Microsoft corporation In addition this document may include names company logos and trademarks which are registered trademarks and therefore are property of their respective owners Fastwel welcomes suggestions remarks and proposals regarding the form ...

Page 6: ...itive Device This symbol draws your attention to the information related to electro static sensitivity of your product and its components To keep product safety and operability it is necessary to handle it with care and follow the ESD safety directions Warning Hot surface This sign marks warnings about hot surfaces The surface of the heatsink and some components can get very hot during operation T...

Page 7: ...witched off During installation repairs and maintenance of the device there is a real danger of exposure to electric shock therefore you should always disconnect the power supply feeding cable from the socket at the time of works Board Handling Regulations ESD Sensitive Device Electronic boards and their components are sensible to static electricity This is why you should give special attention to...

Page 8: ...abilities The manufacturer guarantees that device s quality corresponds to the requirements of technical specification TU 4013 022 72782511 08 provided that the Consumer meets operation storage transportation and installation conditions and procedures specified by accompanying documents The Manufacturer hereby guarantees that the products supplied thereby are free from defects in workmanship and m...

Page 9: ...ansportation storage installation mounting or accident Procedure of device returning for repairs Sequence of activities when returning the products for repairs Apply to Fastwel company or to any of the Fastwel s official representatives for the Product Return Authorization Attach a failure inspection report with a product to be returned in the form accepted by the Manufacturer with a description o...

Page 10: ...er consumption and high reliability 1 2 Versions ordering information 1 2 1 Versions Module s versions and their designations at the time of the order ordering information are given in the table below 1 1 Table 1 1 CPC1302 ordering information Versions CPU RAM SSD Temperature 1 CPC1302 01 Intel Core i7 5850EQ 2 7 GHz 4C 37 W 8 GB 1600 DDR3L 16 GB 40 85 C 2 CPC1302 02 Intel Core i7 5850EQ 2 7 GHz 4...

Page 11: ...CPC1302 CPU Module Intel Core i7 5850EQ 2 7 GHz 4 Core 8GB DDR3L SDRAM 40 85 C CPC1302 03 CPC1302 CPU Module Intel Core i5 4422E 1 8 GHz 2 Core 4GB DDR3L SDRAM embedded SSD 16GB 40 85 C CPC1302 04 CPC1302 CPU Module Intel Core i5 4422E 1 8 GHz 2 Core 4GB DDR3L SDRAM 40 85 C 1 2 3 Available options for CPC1302 Table 1 2 CPC1302 ordering options Pre installed operating system LNX Linux 3 8 x OS pre ...

Page 12: ... 5 L 8 mm 6 Jumper TE Connectivity p n 382575 2 1 Pitch 2 mm 1 3 2 Additional complete sets for heat removal Additional accessories for heat removal are specified in the table below Table 1 5 Additional sets for CPC1302 Heat removal system ACS30076 01 Heatsink ACS30076 02 Heatsink with a fan Module is delivered ready assembled with the heat spreading plate Additional complete sets for heat removal...

Page 13: ...ics 4600 Memory up to 2 GB DirectX 11 1 OpenGL 4 0 OpenCL 1 2 H 264 MPEG 4 AVC MPEG 2 FLASH BIOS 128 Mb SPI Flash modifiable within the system FRAM 32 Kbyte SPI port for storing user data COM Express Type 6 connector 1 port PCIe x16 GEN3 8 GT s 7 8 ports PCIe x1 GEN2 5 GT s 8x ports USB 2 0 4x ports USB 3 0 4x ports SATA III 6Gbps Port LAN 0 Gbit Ethernet Intel 210 Port SPI External Boot Port LVDS...

Page 14: ...s connector In order to support the sleep modes the standby voltage is used 5V_STBY from COM Express connector optional At 12 V input protection against over voltage and pulse interference is provided Acceptable range of the main supply voltage 8 14 V Acceptable range of the standby supply voltage 4 75 5 25 V 1 5 3 Consumption currents of the modules Table 1 6 Consumption currents of CPC1302 CPU M...

Page 15: ...h conformal coating in accordance with the GOST 28216 1 7 Resistance to mechanical effects The modules complying with the GOST standard 28203 are resistant to sinusoidal vibrations for frequencies from 10 to 500 Hz with acceleration of 2 g The modules complying with the GOST standard 28213 are resistant to single shocks with the peak acceleration of 50 g The modules complying with the GOST standar...

Page 16: ... complete sets for heat removal Table 1 9 Weight and dimensions of additional complete sets for heat removal Additional complete set Overall dimensions no more than ACS30076 01 125 5х95 5х25 0 ACS30076 02 125 5х95 5х40 0 Table 1 10 Weight and dimensions of additional complete sets for heat removal Additional complete set Weight in kg no more than ACS30076 01 280 ACS30076 02 380 ...

Page 17: ...le 1 11 MTBF CPU Module MTBF in hours not less than CPC1302 150 000 Note MTBF values are calculated according to the Telcordia Issue 1 computational model calculation method Method I Case 3 for continuous operation in case of the on ground placement under conditions corresponding to the Moderately Cold Climate 4 climatic category in accordance with the GOST 15150 69 at the ambient temperature of 3...

Page 18: ... operation of CPC1302 major components 2 1 Location of main components Location of main components and connectors is given in Figure 2 1 and Figure 2 2 Purpose of indicators and XP1 switch is given in subsections 3 1 and 3 2 CPU HL1 HL2 HL3 XP1 PCH Fig 2 1 Location of main components of CPC1302 top view ...

Page 19: ...PC1302 User Manual 0 19 Description of operation of CPC1302 major components CPC1302 Connector COM Express C D Connector COM Express A B Fig 2 2 Location of COM Express connectors of CPC1302 bottom view ...

Page 20: ...CPC1302 User Manual 0 20 Description of operation of CPC1302 major components CPC1302 2 2 Functional structure of CPC1302 Block diagram of CPC1302 is shown in Figure 2 3 Fig 2 3 Module block diagram ...

Page 21: ...ure 37 5 x 32 mm PCH Intel QM87 Highly integrated controller of interfaces including standard peripherals of IBM PC AT platform and modern high speed interfaces PCI E Gen2 SATA 6 Gps USB 2 0 3 0 Implemented in BGA enclosure 20х20mm has a heat dissipation which is by 20 lower as compared to the one of the previous controller QM77 DDR3L SDRAM The board can be equipped with 18 soldered microchips DDR...

Page 22: ... port The COM Express connector is equipped with 4 routed USB 3 0 ports Super Speed Gbit Ethernet port The board is equipped with 1 Gbit Ethernet channel External controller Gigabit Ethernet I210 connected to the 8 th port PCI E is used Controller can be switched off in BIOS in this case the COM Express connector will have 8 ports available COM1 COM2 ports The ports are implemented on EXAR XR28V38...

Page 23: ...IO ports Watchdog timer diagnostics LED start and control of power supply modes WDT The module uses one hardware watchdog timer with modifiable actuation interval from 1 µsec up to 10 minutes is implemented in FPGA 2 3 Connectors COM Express A B C D CPC1302 is equipped with the standard COM Express connectors see Fig 2 2 using which CPC1302 is connecting with the carrier board Purpose of the conta...

Page 24: ...m version of BIOS is applied The groups of 0 3 and 4 7 ports can be configured regardless of each other During the standard supply the ports are configured as 7x1 when Ethernet is activated and 8x1 when Ethernet is deactivated Port0 Port1 Port2 Port3 X4 X2 X2 X2 X1 X1 X1 X1 X1 X1 Gbe is off Port4 Port5 Port6 Port7 X4 X2 X2 X2 X1 X1 X1 X1 X1 X1 Gbe is on Port4 Port5 Port6 Port7 X2 X1 N A X1 X1 X1 N...

Page 25: ...AM lock status 5 1 Reserved 0 BURST mode The controller automatically generates the sequence of access to FRAM on SPI bus address from registers BASE 0 BASE 1 write read mode and data register BASE 2 The las kilobyte from 32 Kbyte is backed up for storing the BIOS Setup settings Bit 0 in the control register Base 3 includes the mode of automatic increase of address during reading writing of data r...

Page 26: ... activation deactivation of watchdog timer The watchdog timer contains 24 bit counter register Timer Current Value Register decremented with the frequency of 32768 kHz and initial value register Timer Initial Value Register When the counter register is zeroed it could lead to either interrupt or board automatic reset in case of counter double zeroing Actuation time can be set from 0 though 512 sec...

Page 27: ...e lesser or equal timeout value we regularly perform counter reset using any of the methods described above If the counter is not reset during the first timeout interval TMF flag is set and interrupt will appear if allowed If the counter is not reset during the second timeout interval STF flag is set and the board will reboot if the reset was allowed 2 8 1 Watchdog timer s registers Input output a...

Page 28: ...nt_Value 15 8 Write Read Bits 15 8 of the current counter value Base 2h Bit Name Description 7 0 Timer_Current_Value 23 16 Write Read Bits 23 16 of the current counter value Timer Initial Value Register 23 0 Base 3h Bit Name Description 7 0 Timer_Initial_Value 7 0 Write Read Bits 7 0 of initial counter value Base 4h Bit Name Description 7 0 Timer_Initial_Value 15 8 Write Read Bits 15 8 of initial ...

Page 29: ...generated over this flag The reset is carried out by writing any number to the registers of the current value Control Register Base 7h Bit Name Description 7 3 Reserved 2 INTM Write Read 1 interrupt is on 0 interrupt is off 1 CNTE Write Read Counter 1 decrement is ON 0 switched off 0 RSTE Write Read Board reset on timeout 1 Reset is permitted 0 Reset is prohibited 2 9 I2C Controllers input output ...

Page 30: ...gister and continuing writing transaction MCF 0 Transfer mode selection and transaction start MTX 1 MSTA 1 Transaction is over MCF 1 No Transaction is over MCF 1 Yes No Yes Confirmation is received RXAK 0 Yes Writing of the EEPROM data byte to the data register and continuing writing transaction MCF 0 No Continuing transaction automatic generation STOP condition MCF 0 No Confirmation is received R...

Page 31: ...ng 1 to this bit 6 Reserved 5 MBB R Bus busy flag Is set to 1 if the START condition was recorded and is reset to 0 if the STOP condition was recorded 4 MAL R W Flag of the bus arbitration loss Is set to 1 at bus arbitration loss in START STOP Transmit conditions Should be reset by writing 1 to this bit 3 Reserved 2 Reserved 1 MIF R W Interrupt flag Is installed in the 1 under condition of MCF 1 o...

Page 32: ...edgement of RXAK 1 of the transmit transaction the bit will automatically reset to 0 and the Stop Condition will be initiated 4 MTX R W Selection of transaction mode Writing 1 to this bit sets the transmission mode writing 0 to receipt mode 3 TXAK R W Reception transaction acknowledgement bit Writing 0 to this bit performs acknowledgement ACK writing 1 no acknowledgement is performed 2 RSTA R W Re...

Page 33: ... settings of CPC1302 using XP1 switch Connector name Purpose XP1 Contacts 1 2 are closed CMOS Reset factory reset 3 2 Description of indicators Table 3 2 Description of CPC1302 indicators Indicator names Purpose HL1 Indication of power supply 5V_STBY HL2 Activity LED of SATA HL3 Indicator of module s diagnostics start 3 2 1 Description of HL3 LED operation Table 3 3 Description of HL3 indicator of...

Page 34: ... With such a configuration it is possible to ensure heat dissipation by installing the module immediately on the enclosure or chassis the enclosure fulfills a function of a large heatsink The module 1302 can be additionally equipped with a heatsink from the set ACS30076 01 to be purchased as an option or a user made heatsink The heatsink is installed to the heatspreading plate using a thermal cond...

Page 35: ... of the core is 105 C for CPC1302 03 04 100 C Possibility to control the temperature of CPU cores is ensured by the internal digital temperature sensor DTS Description of DTS registers is provided in documentation of CPU manufacturer Reduction of CPU performance is permitted at the board temperature above 85 С temperature control is performed in accordance with Fig 3 3 For versions CPC1302 01 02 i...

Page 36: ...e T C Fig 3 4 Diagram of CPU temperature dependency on the temperature on plate CPC1302 01 02 modules with heat removal sets ACS30076 02 can be operated at ambient temperatures of up to 70 C without reduction in performance When using the mode 47W up to 55 C CPC1302 03 04 modules equipped with the heat removal sets ACS30076 01 can be operated at ambient temperatures of up to 30 C without reduction...

Page 37: ...ired to strictly follow the below rules and safety requirements in order to avoid damages to the device and not to injure the health of people Manufacturer shall not be liable for any damages arising out as a result of non observance of such requirements Warning Be careful when handling the module since the heat spreading plate and heatsink if installed can become too hot Moreover the module shoul...

Page 38: ...r operation of the system 2 Prior to installation make sure that the carrier board is compatible with the standard COM Express Type 6 r 2 1 and that the height of the COM Express connectors on the carrier board corresponds to the height of racks on CPC1302 The module is supplied with the installed 5 mm racks 8 mm height racks are supplied in the delivery checklist If the carrier board Adlink Expre...

Page 39: ...system power supply is switched off 3 Unscrew the fastening screws and remove the module from connectors of the carrier board Do not touch the heatsink since it could get too hot during operation 4 Do not place the module in the box or packaging till the module and cooling heatsinks cool down to the ambient temperature 3 8 Elimination of CPC1302 malfunctions The Table 3 4 contains possible malfunc...

Page 40: ...IRST is active Contact the service center The board fails to start HL1 LED is on HL3 is flashing fast 8 Hz BIOS is absent or damaged Check the accuracy of BIOS selection on the carrier board if the selection is available Check the accuracy of BIOS_DIS0 A34 signals and BIOS_DIS 1 B88 signals at COM_Express connector Boot the board from BIOS backup if such is stipulated for the carrier board and res...

Page 41: ...update BIOS update is carried out using the Flash Programming Tool utility is available on network file servers of the manufacturer and official distributor Actions for updating BIOS There is a BIOS version for CPC1302 available on FTP 1302_Vxxx bin Example of BIOS update via an integrated UEFI SHELL 1 Copy EFI utility to USB drive root directory 2 Copy with the new BIOS to the EFI catalog 3 Conne...

Page 42: ... type of transport During handling and transportation operations the packaged modules should not undergo sharp pounding falls shocks and exposure to atmospheric precipitation The packaged modules should be stored in a carrier vehicle in such a manner which will prevent their moving 5 2 Unpacking Prior to unpacking before transportation at subzero temperature of ambient air the modules should be ke...

Page 43: ...0_MDI1 A11 GND A12 GBE0_MDI0 A13 GBE0_MDI0 A14 NC A15 SUS_S3 PP 3 3V_STBY PD 10K A16 SATA0_TX A17 SATA0_TX A18 SUS_S4 PP 3 3V_STBY PD 10K A19 SATA0_RX A20 SATA0_RX A21 GND A22 SATA2_TX A23 SATA2_TX A24 SUS_S5 PP 3 3V_STBY PD 10K A25 SATA2_RX A26 SATA2_RX A27 BATLOW PU 10K 3 3V_STBY A28 S ATA_ACT OD 3 3V_STBY A29 AC HDA_SYNC PP 3 3V A30 AC HDA_RST PP 3 3V A31 GND A32 AC HDA_BITCLK PP 3 3V A33 AC HD...

Page 44: ... A53 PCIE_TX5 A54 GPI0 CM 3 3V_STBY A55 PCIE_TX4 A56 PCIE_TX4 A57 GND A58 PCIE_TX3 A59 PCIE_TX3 A60 GND A61 PCIE_TX2 A62 PCIE_TX2 A63 GPI1 CM 3 3V_STBY A64 PCIE_TX1 A65 PCIE_TX1 A66 GND A67 GPI2 CM 3 3V_STBY A68 PCIE_TX0 A69 PCIE_TX0 A70 GND A71 LVDS_A0 A72 LVDS_A0 A73 LVDS_A1 A74 LVDS_A1 A75 LVDS_A2 A76 LVDS_A2 A77 LVDS_VDD_EN PP 3 3V A78 LVDS_A3 A79 LVDS_A3 A80 GND A81 LVDS_A_CK A82 LVDS_A_CK A8...

Page 45: ...ND A101 SER1_TX OD 3 3V A102 SER1_RX CM 3 3V A103 LID A104 VCC_12V A105 VCC_12V A106 VCC_12V A107 VCC_12V A108 VCC_12V A109 VCC_12V A110 GND B1 GND B2 GBE0_ACT OD 330oHm B3 LPC_FRAME PP 3 3V B4 LPC_AD0 PP 3 3V B5 LPC_AD1 PP 3 3V B6 LPC_AD2 PP 3 3V B7 LPC_AD3 PP 3 3V B8 LPC_DRQ0 PP 3 3V B9 LPC_DRQ1 PP 3 3V B10 LPC_CLK PP 3 3V B11 GND B12 PWRBTN PU 10K 3 3V_STBY B13 SMB_CK 2 2K PU 3 3V_STBY B14 SMB_...

Page 46: ...USB7 B37 USB7 B38 USB_4_5_OC 10K PU 3 3V_STBY B39 USB5 B40 USB5 B41 GND B42 USB3 B43 USB3 B44 USB_0_1_OC 10K PU 3 3V_STBY B45 USB1 B46 USB1 B47 EXCD1_PERST PP 3 3V_STBY B48 EXCD1_CPPE PP 3 3V_STBY B49 SYS_RESET 10K PU 3 3V B50 CB_RESET PP 3 3V_STBY 10K PD B51 GND B52 PCIE_RX5 B53 PCIE_RX5 B54 GPO1 PP 3 3V_STBY B55 PCIE_RX4 B56 PCIE_RX4 B57 GPO2 PP 3 3V_STBY B58 PCIE_RX3 B59 PCIE_RX3 B60 GND B61 PC...

Page 47: ...3 3V B84 VCC_5V_SBY B85 VCC_5V_SBY B86 VCC_5V_SBY B87 VCC_5V_SBY B88 BIOS_DIS1 PU 10K 3 3V_STBY B89 VGA_RED PD 150ohm B90 GND B91 VGA_GRN PD 150ohm B92 VGA_BLU PD 150ohm B93 VGA_HSYNC 22 6 ohm series B94 VGA_VSYNC 22 6 ohm series B95 VGA_I2C_CK PU 2 2K 3 3V B96 VGA_I2C_DAT PU 2 2K 3 3V B97 SPI_CS PU 100K 3 3V_STBY B98 NC B99 NC B100 GND B101 FAN_PWMOUT B102 FAN_TACHIN B103 SLEEP B104 VCC_12V B105 ...

Page 48: ... PCIE_RX7 C23 PCIE_RX7 C24 DDI1_HPD 100K PD C25 NC C26 NC C27 NC C28 NC C29 NC C30 NC C31 GND C32 DDI2_CTRLCLK_AUX PU 2 2K 3 3V PD 100K C33 DDI2_CTRLDATA_AUX PU 2 2K 3 3V PU 100K 3 3V C34 DDI2_AUXSEL PD 1M C35 NC C36 DDI3_CTRLCLK_AUX PU 2 2K 3 3V PD 100K C37 DDI3_CTRLDATA_AUX PU 2 2K 3 3V PD 100K C38 DDI3_AUXSEL PD 1M C39 DDI3_PAIR0 C40 DDI3_PAIR0 C41 GND C42 DDI3_PAIR1 C43 DDI3_PAIR1 C44 DDI1_HPD...

Page 49: ...59 PEG_RX2 C60 GND C61 PEG_RX3 C62 PEG_RX3 C63 NC C64 NC C65 PEG_RX4 C66 PEG_RX4 C67 NC C68 PEG_RX5 C69 PEG_RX5 C70 GND C71 PEG_RX6 C72 PEG_RX6 C73 GND C74 PEG_RX7 C75 PEG_RX7 C76 GND C77 NC C78 PEG_RX8 C79 PEG_RX8 C80 GND C81 PEG_RX9 C82 PEG_RX9 C83 NC C84 GND C85 PEG_RX10 C86 PEG_RX10 C87 GND C88 PEG_RX11 C89 PEG_RX11 C90 GND C91 PEG_RX12 C92 PEG_RX12 C93 GND ...

Page 50: ...2 C108 VCC12 C109 VCC12 C110 GND D1 GND D2 GND D3 USB_SSTX0 D4 USB_SSTX0 D5 GND D6 USB_SSTX1 D7 USB_SSTX1 D8 GND D9 USB_SSTX2 D10 USB_SSTX2 D11 GND D12 USB_SSTX3 D13 USB_SSTX3 D14 GND D15 DDI1_CTRLCLK_AUX PU 2 2K 3 3V PD 100K D16 DDI1_CTRLDATA_AUX PU 2 2K 3 3V PU 100K 3 3V D17 NC D18 NC D19 PCIE_TX6 D20 PCIE_TX6 D21 GND D22 PCIE_TX7 D23 PCIE_TX7 D24 NC D25 NC D26 DDI1_PAIR0 D27 DDI1_PAIR0 D28 NC ...

Page 51: ...0 D41 GND D42 DDI2_PAIR1 D43 DDI2_PAIR1 D44 DDI2_HPD 100K PD D45 NC D46 DDI2_PAIR2 D47 DDI2_PAIR2 D48 NC D49 DDI2_PAIR3 D50 DDI2_PAIR3 D51 GND D52 PEG_TX0 D53 PEG_TX0 D54 PEG_LANE_RV PU 10K 3 3V D55 PEG_TX1 D56 PEG_TX1 D57 GND D58 PEG_TX2 D59 PEG_TX2 D60 GND D61 PEG_TX3 D62 PEG_TX3 D63 NC D64 NC D65 PEG_TX4 D66 PEG_TX4 D67 GND D68 PEG_TX5 D69 PEG_TX5 D70 GND D71 PEG_TX6 D72 PEG_TX6 D73 GND D74 PEG...

Page 52: ...10 D87 GND D88 PEG_TX11 D89 PEG_TX11 D90 GND D91 PEG_TX12 D92 PEG_TX12 D93 GND D94 PEG_TX13 D95 PEG_TX13 D96 GND D97 NC D98 PEG_TX14 D99 PEG_TX14 D100 GND D101 PEG_TX15 D102 PEG_TX15 D103 GND D104 VCC12 D105 VCC12 D106 VCC12 D107 VCC12 D108 VCC12 D109 VCC12 D110 GND Interpretation OD open drain PP PD pull down PU pull up CM CMOS input PP push pull output of СMOS ...

Page 53: ...onditions of cooperation should be made in writing 3 3 Any delivery of Fastwel electronics is submitted with the right package in accordance with the current rules and standards in the Member States of the European Economic Area The purchaser independently bears all risks regarding the compliance of package and marking of Fastwel products with legislation requirements being in effect at the place ...

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