S1D16400 Series
2–4
EPSON
5. PAD LAYOUT
100
105
95
90
85
80
75
70
65
60
55
50
45
40
25
20
15
10
5
1
35
30
(0,0)
Chip size ............................ 11.59mm x 1.40mm
Pad pitch ............................ 105
µ
m (Min.)
Chip thickness .................... 625
µ
m
±
25
µ
m
Au bump specification (S1D16400D00B
*
) reference values
Bump size
A
160
µ
m
×
80
µ
m
±
4
µ
m
(Pad No. 2 ~ 26)
Bump size
B
86
µ
m
×
91
µ
m
±
4
µ
m
(Pad No. 1, 27, 37 and 98)
Bump size
C
86
µ
m
×
68
µ
m
±
4
µ
m
(Pad No. 28 ~ 36 and 99 ~ 107)
Bump size
D
82
µ
m
×
74
µ
m
±
4
µ
m
(Pad No. 38 ~ 97)
Bump height A ~ D
22.5
±
5.5
µ
m
(Pad No. 1 ~ 107)
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Summary of Contents for S1D16000 Series
Page 5: ...Selection Guide www DataSheet4U com ...
Page 7: ...S1D16006 Series Rev 2 1 www DataSheet4U com ...
Page 23: ...S1D16400 www DataSheet4U com ...
Page 38: ...S1D16501 Rev 1 0 www DataSheet4U com ...
Page 53: ...S1D16700 Rev 1 1 www DataSheet4U com ...