S1D16702 Series
Rev.1.0
EPSON
5–13
11. LCD DRIVE POWER
Each voltage level forming method
To obtain each voltage level for LCD driving, it is the most simple to divide the resistance of potential as shown
in the connection example.
On the other hand, to obtain a high quality display, it is necessary to raise the accuracy and constancy of each
voltage level and to set the divided resistance value as low as possible in the range of system power capacity.
Especially when a low-power LCD driving is required, set the divided resistance to a higher value and drive
the LCD with a voltage follower by means of operational amplifier instead. In taking into consideration of
a case where the operational amplifier is employed, the maximum potential level V
0
for LCD driving has been
isolated from the V
DD
pin. When the potential of V
0
lowers than that of V
DD
and the potential difference
between the two becomes larger, however, the capacity of LCD drive output driver lowers. To avoid it, use
the system with the potential difference of 0 V to 2.5 V between V
0
and V
DD
.
When no operational amplifier is used, connect V
0
and V
DD
pins.
Note in power ON/OFF
Since this LSI is high in the voltage of LCD driving system, when a high voltage is applied to the LCD driving
system with the logic system power supply kept floating, an overcurrent flows and LSI breaks down in some
cases.
Be sure to follow the power ON/OFF sequence as shown below:
At power ON ... Logic system ON
→
LCD driving system ON or simultaneous ON of the both
At power OFF ... LCD driving system OFF
→
Logic system OFF or simultaneous OFF of the both
Precautions:
Users of this development specification are reminded of the following precautions.
1. This development specification is subject to change without previous notice.
2. This specificatino does not warrant the user to exercise the industrial property right or other rights, nor does
this specification vest such rights to the user.
Application examples provided in this specification are solely intended to ensure better understanding of
the product. The manufacturer shall not be liable for any circuit related problem arising from using such
examples.
Numeric representation of measure or size provided in the characteristics table is one obtained from the
numeric line.
3. No part of this specification may be reproduced or duplicated in any form or by any means without the
written permission of the manufacturer.
4. As for use of semiconductor elements, users are required to pay attention to the following points.
[Precautions on the Product Handling in Light]
Characteristics of semiconductor elements are changed if they are exposed to light. Thus, exposing this
IC to light can result in its in malfunction. In order to prevent IC malfunctioning due to light, make sure
that the following measures are taken for the boards or products equipped with our IC.
(1) Design and mounting procedure employed do not allow light to IC.
(2) The inspection process is implemented in the environment that does not allow light to IC.
(3) Light shielding measures are established not only for surface of IC but also for rear face and side faces,
too.
www.DataSheet4U.com
Summary of Contents for S1D16000 Series
Page 5: ...Selection Guide www DataSheet4U com ...
Page 7: ...S1D16006 Series Rev 2 1 www DataSheet4U com ...
Page 23: ...S1D16400 www DataSheet4U com ...
Page 38: ...S1D16501 Rev 1 0 www DataSheet4U com ...
Page 53: ...S1D16700 Rev 1 1 www DataSheet4U com ...
