S1D16006 Series
1–4
EPSON
Rev.2.1
5. PAD
Á
Pad Layout
Chip size: ........................... 5.59 mm
×
3.50 mm
Pad pitch: ........................... 0.153 mm (Min.)
Chip thickness: ................... 0.400 mm (AL-pad die form)
0.525 mm (Au-bump die form)
Au bump specifications [Reference values]
Bump size:
117
µ
m
×
109
µ
m
±
20 um
Bump height:
17
µ
m to 28
µ
m (Details shall be stipulated in the delivery specification.)
AL-pad die form
Pad Opening
87
×
76
µ
m
(0.0)
Y
X
75 50
65
80 60
70
55
85
90
95
100 1
5
10
15
20
25
30
35
40
45
D1606D
0B
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Summary of Contents for S1D16000 Series
Page 5: ...Selection Guide www DataSheet4U com ...
Page 7: ...S1D16006 Series Rev 2 1 www DataSheet4U com ...
Page 23: ...S1D16400 www DataSheet4U com ...
Page 38: ...S1D16501 Rev 1 0 www DataSheet4U com ...
Page 53: ...S1D16700 Rev 1 1 www DataSheet4U com ...