11.3.5 Overhaul
The recommended maintenance intervals for different process applications are
tabulated below:
Process Period
Remarks
Metal Etch
1 year
Ensure that TMS (Temperature Management
System) is fitted and operational to prevent
accumulation of by-product deposition in the
pump.
Other Etch
Processes
2 years
Et
ch
in
g
*1
It is recommended to change the pump rotor after 5 years due to accumulated
wear of the protective plating material
Other semiconductor
process
2 years
Processes resulting in accumulation of deposits
in the pump will require more frequent
service.
Clean applications
(Only vacuum
pumping)
5 years
Other use
(2 years)
Dependent on application, contact BOC
Edwards.
◇
The touch dow n bearing inside the STP pump w ill be w orn out after a number of
full speed touch dow ns.
The costs of replacing parts that need to be replaced because of deterioration or abrasion
will be at your own charge.
When overhaul of the STP pump or the STP control unit is needed, contact Service
office.
*1
“Etching” includes semiconductor etching and LCD etching.
