Embedded Solutions
Page 34 of 37
Construction and Reliability
PMC Modules were conceived and engineered for rugged industrial environments. The
PMC-BISERIAL-III RL1 is constructed out of 0.062-inch thick FR4 material.
Through-hole and surface-mount components are used. The PMC connectors are rated
at 1 Amp per pin, 100 insertion cycles minimum. These connectors make consistent,
correct insertion easy and reliable.
The PMC is secured against the carrier with four screws attached to the 2 stand-offs
and 2 locations on the front panel. The four screws provide significant protection
against shock, vibration, and incomplete insertion.
The PMC Module provides a low temperature coefficient of 2.17 W/
°
C for uniform heat.
This is based upon the temperature coefficient of the base FR4 material of 0.31 W/m-
°
C, and taking into account the thickness and area of the PMC. The coefficient means
that if 2.17 Watts are applied uniformly on the component side, then the temperature
difference between the component side and solder side is one degree Celsius.
Thermal Considerations
The PMC-BISERIAL-III RL1 design consists of CMOS circuits. The power dissipation
due to internal circuitry is very low. It is possible to create higher power dissipation with
the externally connected logic. If more than one Watt is required to be dissipated due to
external loading, then forced-air cooling is recommended. With the one degree
differential temperature to the solder side of the board, external cooling is easily
accomplished.
Warranty and Repair
Please refer to the warranty page on our website for the current warranty offered and
options.
http://www.dyneng.com/warranty.html
