Copyright
©
2018
congatec
AG
TR44m17
13/65
2
Specifications
2.1
Feature List
Table 4
Feature Summary
Form Factor
Based on COM Express™ standard pinout Type 6 (Basic size 95 x 125 mm)
SoC
4th Generation AMD Embedded V- and R-Series (FP5) SoC.
NOTE:
R-Series is not available yet.
Memory
Two memory sockets (located on the top and bottom side of the conga-TR4). Supports:
-
SO-DIMM ECC and non-ECC DDR4 memory modules
-
Data rates up to 3200 MT/s with single rank memory
-
Maximum 32 GB capacity (16 GB on each socket)
Chipset
Integrated in the SoC
Audio
High Definition Audio (HDA) interface with support for up to three codecs.
Ethernet
1x Gigabit Ethernet PHY or via the onboard Intel
®
Ethernet i210 Controller (i211 available as assembly option).
Graphics Options
AMD Radeon™
Vega Graphics Core (GFX9). Supports:
-
DirectX
®
12, EGL 1.4, OpenCL
®
2.1, OpenGL
®
ES (1.1, 2.x and 3.x), OpenGL
®
Next, OpenGL
®
4.6
-
Video Core Next (VCN): H.265/HEVC HW encode and decode, 10b HEVC and VP9 decode, MS compliant JPEG encode and decode
-
Up to four independent displays (three in R-Series)
1x PCIe Gen 3 (x8/x4) (Only x4 in R-Series)
1x LVDS (default) or 1x eDP (optional)
2x Dedicated DDI (DP/HDMI/DVI)
1x DDI (DP/HDMI/DVI) (N/A in R-Series) multiplexed with USB 3.1 Gen 2
NOTE:
HDMI/DVI requires an external level shifter on carrier board.
Peripheral Interfaces
USB up to:
-
2x USB 3.1 Gen 2
-
2x USB 3.1 Gen 1 (Only 1x in R-Series)
-
4x USB 2.0
2x SATA
®
6 Gb/s ports
4x PCIe Gen 3 (x4/x2/x1) (Only 3x PCIe Gen3 (x1) in R-Series)
4x PCIe Gen 2 (x1)
2x UART
Fan control
GPIOs
Buses:
-
SPI
-
LPC
-
SM
-
I²C
BIOS
AMI Aptio
®
UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features
Security
Infineon LPC TPM 2.0 on module. Integrated TPM 2.0 in SoC.
Power Management
ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
cBC
Multi-stage watchdog, manufacturing and board information, board statistics, I2C bus, Power loss control.
Note
Some of the features mentioned in the table above are optional. See Table 2 and Table 3 for available features on each module variant.
