• Materials
The material being applied during the deposition process. This entry turns
to “Custom” if the Density or Z-Factor is modified by the user, in order to
prevent mismatch.
• Density
The density of the selected material being applied.
• Z-Factor
Acoustic impedance factor which is used to compensate for dense
materials and is predefined based on the selected material.
• Tooling [%]
The geometric relationship between the substrate and the positioning of
the sensor.
• Max Power [%]
Represents the maximum power level Eon™ will deliver to the source
[from 0%-100%], even when the heater requires more power to reach the
set-point temperature.
• Proportional
The proportional coefficient that controls the material deposition rate
during the PID phase.
• Integral
The integral time constant that controls the material deposition rate during
PID phase.
• Derivative
The derivative time constant that controls the material deposition rate
during the PID phase.
• Dwell Time
The time specified that follows the completion the predeposition process
before activation of the PID. This delay prevents the PID from engaging
the source power prematurely, giving the material a chance to reach
the sensor. (No material is applied to the sensor directly after the
predeposition process finishes, for the brief time it takes for the material to
initially transition from the source to the crystal in the event that a shutter is
present).
• Rise to Soak Time
The time specifying how long it takes Eon™ to raise source power from
0% to desired soak power
24
Chapter 3
Program Control
Layer Properties Defined
The following is a list of settings that defines the parameters of the deposition. All
settings must be set correctly for the software to function properly.
