B&R MAPPC800-ENG, User Manual

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Technical data • Entire device
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37 Panel PC 800 User's Manual V 1.00
2. Entire device
2.1 Temperature specifications
It is possible to combine CPU boards with various other components, such as drives, main
memory, additional insert cards, etc. depending on system unit and fan kit. The various
configurations result in varying maximum possible ambient temperatures, which can be seen in
the following graphics.
Information on the worst-case conditions
• Thermal Analysis Tool (TAT V3.8) from Intel for simulating 100% processor load
• BurnIn testing tool (BurnIn V4.0 Pro from Passmark Software) to simulate a 100% load
on the interface via loop-back adapters (serial interfaces, slide-in drives, USB interfaces,
audio outputs)
• Maximum system extension and power consumption
What must be considered when determining the maximum ambient temperature?
• Operating the entire device with or without fan kit
Information:
The maximum specified ambient temperatures for operation with and without a fan
kit were determined under worst-case conditions. Experience has shown that higher
ambient temperatures can be reached under typical conditions, e.g. using Microsoft
Windows. The testing and evaluation is to be done on-site by the user (temperatures
can be read in BIOS or using the B&R Control Center).