AMB8426-M_8626-M_MA_EN_V2_4
Page 42 of 48
Released: Nov.2013
Figure 23 shows an example of a solder curve for an approx. 31cm
2
large one sided PCB.
Figure 23:
Example of a temperature curve.
Attention, must be adapted according to the properties of the main PCB!
Only vacuum packed modules may be used for reflow soldering without prior drying. AMBER
wireless offers respective modules in tape & reel packaging. Conventional components must
first be subjected to a drying procedure (e.g. 48 h at 90 °C).
To improve the mechanical stability it is recommended to solder all pads, even if some are not
required for the application.
Attention
! Electrostatic sensitive components.
Care should be taken when handling these modules to avoid electrostatic damage.
