4 Wafer Mapping & Die Sampling
4-15
Test area map/Reference die
Testing
Sampling
dice
For sample
die testing
only
Automatic
Manual
Die attribute setting on the
wafer map or die image screen
Data-in sampling
start die?
Data-in sampling starting
die
Die attribute
setting
For the normal
probing after
sample die testing
sampling die
testing before
normal
probing?
After contact height determination
start die positioning / probing start
Data-in other sampling dice
Data-in sampling
start die?
Data-in sampling starting
die
Data-in other sampling dice
4.5 Sampling Dice Setting
At setting the Device parameter “Probing Mode” to “Sample”, after completion of the test area
map and reference die setting on the Device initial wafer, the Data-in on sample dice will be
demanded. At the end of the sample die selection, the contact height determination process will
begin.
With the parameter set to “Sample & Regular”, the Data-in on the sample dice is demanded
after the die attribute setting on the test area map. The die attribute entry is necessary for the
wafer testing after the sample die testing. After the sample die Data-in, the contact height
determination will start. (When the yield of sample dice is an OK level, the whole wafer testing
will take place; in the testing the sample dice will be tested again.)
The sample die testing sequence is determined by the sample die selection order including the
sampling start die regardless of their locations.
The sample die data are saved in the Device data file, so it is not necessary to register the
sample dice again for a repetitive lot process of the same Device.
