4 Wafer Mapping & Die Sampling
4-4
4-point Data-in
Test area
M
M
M
M
M
M
M
M
M
M
M
M
At “All Dice Except Test Dice”; “M” represents the
forced marking die. (Marking die margin = 50%)
S
S
S
S
S
S
S
S
S
S
S
S
S
S S
S
S
S S
S
S
S
S
S
S
S
S
S
At “Dice by Data In”; “S” represents the skipping
die.
Perform Skipping Die?
Choose whether to specify the skipping dice or not.
Marking Die Setting
If “All Dice Except Test Die” is selected, outside the
range specified by “Test Area Determination”, the die
which has an area (%) more than the value set by
“Marking Die Margin” (refer to “5.1 Marking Setting” in
Control Parameters, USER’S MANUAL) becomes the
forced marking target. In “Dice by Data-In”, all the
area outside the range specified by “Test Area
Determination” becomes skipping dice. Of these dice,
only the dice whose die attribute is specified as forced
marking, will be forcibly marked. (Example of forced
marking/skipping dice setting when the measurement
area is set by 4-point Data-In, is shown in the figure
on the left.)
Method For Constructing Test Die Map
When “Range Directly’ or “4-Pt Data-In” is selected in
“Test Area Determination”, this parameter is used to
select using the alignment camera images or using
the microscope. Normally select using the camera
images.
Method of Die Attribute Selection
This parameter is used to select the method of
specifying the attribute of normal (test) die, forced
marking die, skipping die or probe mark examination
die on the wafer map.
“Map Display” specifies the attribute of each die using
he cursor on the map displayed on the screen.
“Camera Image” and “Microscope” specify the
attribute by individually checking each die using a
camera or microscope. (Map display and camera
image use can be switched when executing the
attribute specification.)
Perform One-Point DATA-IN?
Not effective at present.
