Chapter 3 Installation Preparation
several points (Make sure the copper foils are pressed between the cement floor and
semi-conductive floor and is connected with the grounding cable).
l
EMI Protection Requirements
Electric field strength is 300mV/m and magnetic field strength must not exceed 11GS.
l
Dust-Proof Requirements
à
The density of dust particle whose diameter is larger than 5μm must be less than
30000/m
3
.
à
Dust
particles
must
be
non-conductive,
non-magnetic
inductive,
and
non-corrosive.
The following measures are recommended for dust-proof in the lab:
à
Doors and windows must be sealed. The external windows must be sealed with
double-layer glass and the doors must be sealed with dust-proof sealing strips.
The ideal condition is to seal the lab with a shutter equipped with a dust filter
device.
à
Work clothes and slippers must be kept clean and changed regularly.
à
It is recommended to place operation equipment in outer room, thus avoiding
frequent access and opening/closing of lab door.
à
Keep a higher relative humidity within the permissible range in the lab to reduce
static electricity adsorption of dust.
à
Walls and ceiling of the lab must be painted or pasted with wall paper. It is better
to use lusterless paint.
l
Temperature and Humidity Requirements
The detailed requirements to temperature and humidity are shown in
Table 3-1
.
Table 3-1 Temperature and Humidity Requirements
Temperature
Relative Humidity
Items
Long-Term
Working
Condition (Note
1)
Short-Term
Working
Condition (Note
2)
Long-Term
Working
Conditions
Short-Term
Working
Conditions
Range
15
℃
~30
℃
-5
℃
~45
℃
40%~65%
20%~90%
3-3
SJ-20110803091932-002|2011-08-30 (R2.0)
ZTE Proprietary and Confidential
