Appendix B
SPECIFICATIONS
Contents
Page
ELECTRICAL SPECIFICATIONS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-1
ZT 8825 Power Requirements
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-1
ZT 88CT25 Power Requirements
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-2
STD Load Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-2
ENVIRONMENTAL SPECIFICATIONS
. . . . . . . . . . . . . . . . . . . . . . . . . . .
B-4
Operating Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-4
Storage Temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-4
MECHANICAL SPECIFICATIONS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-4
Card Dimensions & Weight
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B-4
ELECTRICAL SPECIFICATIONS
ZT 8825 Power Requirements
+5 VDC
±
5% @ .50 A typ., 0.67 A max (not including memory
chips)
ZT 96008 memory kit: +5 V
±
10% @ 0.05 A max, including four
32K x 8 RAM chips
ZT 96009 memory kit: +5 V
±
10% @ 0.13 A max, including one
64K x 8 EPROM chip
ZT 96010 memory kit: +5 V
±
10% @ 0.04 A max, including one
128K x 8 RAM chip
ZT 96011 memory kit: +5 V
±
10% @ 0.04 A max, including four
128K x 8 RAM chips
B-1
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