© 2013/EN Zep Solar, Inc. reserves the right to make specifications changes without any prior notice. All rights reserved.
www.zepsolar.com
Document #800-0329-001 Rev F
File Generated July 3, 2013
Page 27
ZS SPAN INSTALLATION MANUAL FOR RAIL-BASED APPLICATIONS - U.S.
Selected versions of the Cam Foot also create an electrical bond as well.
Figure 4.10 Bonding Path - Rockit
4.3.2 Special Bonding Component Options
Hybrid Interlocks and Grounding.
Zep Solar, Inc. offers both bonding and non-bonding versions
of the Hybrid Interlock. National code requirements determine which component is available
within each country. If an installed layout has a continuous column of Hybrid Interlocks, and the
bonding version is not available, a Ground Zep must be installed on either side of that column.
Cam Feet and Grounding.
Bonding versions of the Cam Foot also create an electrical bond with
modules on both Key and Tongue sides of the Cam Foot Rockit. The Cam Foot creates an electrical
bond with the Spanner Bar as well.
Spanner Bar Splicing and Grounding.
The Splice Kit creates an electrical bond between two
sections of Spanner Bar when they are fully spliced together.
Ground Zep Module Limit.
A single Ground Zep can be used as a connection point to ground an
array up to 33 x 33 feet.
4.4 Thermal Expansion
There are two methods to address thermal expansion and contraction within Zep Compatible
arrays: Thermal Expansion Joints and physical gaps or breaks between sub-arrays.
Thermal Expansion Joints consist of Interlocks that are installed in a manner that allows modules
to slide back and forth as they expand and contract in response to daily temperature swings on the
roof. This allows the modules some added flexibility to expand in the direction that the Interlocks
are running. In the other direction, a physical gap is required to allow for thermal expansion of the
modules. Generally, a gap of at least 12” between sub-arrays is recommended, both for thermal
expansion and to allow access by work crews for module servicing.
4.4.1 When Are Thermal Expansion Joints Needed?
Thermal expansion must be addressed under the following conditions:
•
Array sizes larger than approximately 33 feet in either direction.
•
After two consecutive Thermal Expansion Joints, a physical gap is required.
Interlock
Cam Foot with
Grounding/Earthing
Rockit
Ground Zep
Earthing Conductor
Bond path