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Document #800-0329-001 Rev F
File Generated July 3, 2013
Page 26
ZS SPAN INSTALLATION MANUAL FOR RAIL-BASED APPLICATIONS - U.S.
4.3.1 Bonding Path Examples
The following examples show how a Zep Compatible PV array is hyper-bonded using Interlocks.
Figure 4.8 Bonding Path - Simple Array
Figure 4.9 Bonding Path - Hybrid Interlocks or Thermal Expansion Joints
Interlock
Ground Zep
Equipment Grounding
Conductor (EGC)
Bond path
Array Skirt
Interlock
Hybrid Interlock or
Thermal Expansion
Joint
Ground Zep
Equipment Grounding
Conductor (EGC)
Bond path
An array with a continuous column of Hybrid Interlocks (or a Thermal Expansion Joint) must be
installed with a Ground Zep on either side of the column and a copper conductor wire between
the two, in order to bond the two electrically isolated sub-arrays.
Array Skirt