VersaLogic Lion, Справочник по аппаратуре

Страница: 49 / 56

Thermal Considerations
Lion (VL-EPMe-42) Reference Manual 42
EPMe-42 Thermal Characterization
The EPMe-42 board underwent the following thermal characterization tests:

Test Scenario 1: Dual core EPMe-42EAP (Core i3 processor) with passive and active
thermal solutions

Test Scenario 2: Dual core EPMe-42EBP (Core i5 processor) with passive and active
thermal solutions

Test Scenario 3: Dual core EPMe-42ECP (Core i7 processor) with passive and active
thermal solutions

The table below describes the thermal testing setup for the board.
Table 27. EPMe-42 Thermal Testing Setup
Hardware Configuration
EPMe-42 (Lion) dual core CPU with:

HDW-406 (passive heat sink)

HDW-413 (heat sink + fan assembly)

One attached DisplayPort device

Two RS-232 ports in loopback configuration

Two active Ethernet ports

Three USB 2.0 ports in loopback configuration
BIOS

ID string: Lion_3.1.0.334.r1.101

Passive thermal trip point setting: 105ºC

Critical thermal trip point setting: 110ºC
Operating System

Microsoft Windows* 10 Enterprise
Test Software

Passmark* BIT v8.1 Pro
- CPU utilization ~90%

Intel Thermal Analysis Tool* (TAT) v5.0.1026
- Primarily used to read the CPU core temperature
Test Environment

Thermal chamber
The test results reflect the test environment within the temperature chamber used. This particular
chamber has an airflow of about 0.5 meters per second (~100 linear feet per minute). Thermal
performance can be greatly enhanced by increasing the overall airflow beyond 0.5 meters per
second.
The system power dissipation is primarily dependent on the application program - that is, its use
of computing or I/O resources. The stress levels used in this testing are considered to be at the
top of the range of a typical user’s needs.