LEXI-R422 - System integration manual
UBX-23007449 - R02
Design-in
Page 82 of 108
C1-Public
2.10
Module footprint and paste mask
describes the suggested footprint (i.e. copper mask) and paste mask layout for LEXI-R422
modules: the proposed land pattern layout and the proposed stencil apertures layout reflect the
modules pads layout described in the LEXI-R422 data sheet
The recommended thickness of the stencil for the soldering paste is 130 µm, according to application
production process requirements.
16.0
16.0
0.6
0.3
0.6
0.3
0.6
0.3
0.6
0.3
0.6
0.3
0.6
0.3
1.4
1.4
1.4
1.4
All dimensions
in millimeters
Figure 63: Suggested footprint and paste mask for LEXI-R422 modules (application board top view)
☞
These are recommendations only and not specifications. The exact copper, solder and paste mask
geometries, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering etc.) implemented.
