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LASER ENGRAVING&CUTTING CONTROLLER AWC608
、
51
【
Speed
】:
Moving speed of laser head.
【
Power
】:
Adjust size of laser power during processing layer. (Unit: %
)
【
Interval
】:
distance between holes.
【
Time
】:
waiting time of laser head when punching holes.
4.3.2 Adjust Layer Working Sequence
(refer to View 4-3)
Processing sequence in layer list is from top to bottom. If need to change the processing sequence, just
need to select one row of them and then click
or
or
or
Note: Only if the
【
Layer Sequence
】
is selected from path optimization parameter, the layer
working sequence can be valid.
4.4 Machine Control
【
Machine control
】
is to finish downloading of Image, starting & processing and some simple machine
operation control.
View 4-4
4.4
.1 Download image data& machine documents management
(Refer to view 4-4)
Click
to open dialog box as below: