Thermal Dynamics CUTMASTER 81, Руководство по обслуживанию

Страница: 45 / 88

Manual 0-2957 5-5 REPLACEMENT PROCEDURES
C. Logic PC Board Replacement
Follow the antistatic procedures in Subsection 5.02. The
Logic PC Board connects to the Main PC Board through
an extender board perpendicular to both boards.
1. Remove the cover per subsection 5.04-A.
2. Refer to Section 6.05, Left Side Internal Replace-
ment Parts.
3. Remove the bolts in each corner of the Logic PC
Board.
4. Detach the Logic PC Board and the extender board
from the Main Power PC Board. Detach the ex-
tender board from the Logic Board.
5. Install the replacement Logic PC Board by revers-
ing the above steps. The pins on the right edge of
the Logic PC Board must fully engage the sockets
on the edge of the extender board. The extender
board must fully engage sockets on the Main
Power PC Board.
D. IGBT Circuit Board or Input Diode Board
Replacement
Follow the antistatic procedures in subsection 5.02. The
Power Supply includes two IGBT Circuit PC Boards.
NOTE
Follow the electrostatic discharge instructions pro-
vided with the replacement component to prevent
damage to the component.
Thermal pads, heatsinks, and the large flat surface
on the back of diodes and IGBTs must be kept clean.
Diodes and IGBTs must not be bent or allowed to
pick up any foreign material. A very clean instal-
lation between the module and the heatsink or chas-
sis is essential for proper operation.
1. Remove cover per subsection 5.04-A.
2. Turn the Power Supply onto its side.
3. Locate the IGBT Circuit PC Boards or Input Di-
ode mounted within the Main Power PC Board.
Refer to Appendix pages for location and posi-
tion.
4. For IGBTs, remove the small jumpers between the
IGBT and the Main PC Board. Transfer these
jumpers to the replacement IGBT. Label, then re-
move all other wire connections to the Board(s)
being replaced. Note the routing of wires. En-
sure that the wires are put back in the same place
when installing the replacement module.
5. Remove screw(s) securing PC Board(s) to the heat-
sink and remove board(s) from the Power Sup-
ply.
6. Use isopropyl alcohol and a clean rag to clean the
heatsink or chassis area behind the component be-
ing replaced. Clean the large flat surface on the
back of the replacement component. Do not
scratch or abrade the surface.
7. The thermal pad(s), provided with the replace-
ment part, is a thin metal pad. Remove any loose
protective paper coverings from the pad(s).
NOTE
Protective coverings must be removed from the
thermal pads. Installing thermal pads with pro-
tective coverings in place will cause equipment
damage or failure.
8. Install replacement components as follows:
For Input Diodes:
Diode
Assembly
Art # A-03950
Thermal Pad
Slot
Input Diode Replacement
a. Apply the thermal pad to the flat surface of
the diode. Align the pad with the rectangu-
lar flat surface on the back of the device.
b. Align the diode horizontally, with its longer
edges perpendicular to the power supply base.
c. Secure the device and rectangular pad to the
chassis with the replacement screws and wash-
ers.
9. Torque screw(s) to 35 in-lb. (3.95 Nm).
NOTE
Failure to torque properly will cause component dam-
age.