
TAMC900 User Manual Issue 2.0.1
Page 11 of 71
2 Technical Specification
AMC Interface
Mechanical Interface
Advanced Mezzanine Card (AMC) confirming to
PICMG® AMC.0 R2.0, Single, Mid Size Module
Electrical Interface
Virtex-5 FPGA connected to AMC Port 4-11
PICMG® AMC.1 R1.0 Type 4 (x4 PCI Express), or other interfaces
defined by customer
IPMI
IPMI Version
1.5
Front Panel LEDs
Blue Hot Swap LED
Red Fail LED (LED1)
Green User LED (LED2)
On Board Devices
Target Chip
Xilinx Virtex-5 with integrated PCI-Express Endpoint Block and two
integrated Gigabit Ethernet MACs
RAM
2 x 2 MByte QDR-II SRAM
ADC
8 x LTC2254 (105 MSps, 14 bit)
I/O Interface
Number of Analog Channels
8 differential
Analog Input Gain
depends on Signal Conditioning Adapter used
Analog Input Voltage Range
depends on Signal Conditioning Adapter
ADC analog input Voltage (differential) = 2V
P-P
ADC input common mode Voltage = 1V to 1.9V
ADC INL/DNL Error
±1 / ±0.5 LSB (typical)
Number of Clock Inputs
3 differential (LVDS)
Number of Trigger Inputs
3 differential (LVDS)
I/O Connector
120 pin Connector to Signal conditioning adapter that holds the I/O
Connectors for the analog inputs, clocks and trigger signals
Physical Data
Power Requirements
2A typical, 4A max. @ +12V DC (Payload Power)
50 mA typical @ +3.3V DC (Management Power)
The exact Power requirement of the TAMC900 depends on
Signal Cond. Adapter used and FPGA utilization.
Temperature Range
Operating
Storage
0 °C to +55 °C
0 °C to +70 °C
MTBF
391000 h
MTBF values shown are based on calculation according to MIL-HDBK-217F and
MIL-HDBK-217F Notice 2; Environment: G
B
20°C.
The MTBF calculation is based on component FIT rates provided by the component
suppliers. If FIT rates are not available, MIL-HDBK-217F and MIL-HDBK-217F
Notice 2 formulas are used for FIT rate calculation.
Humidity
5 – 95 % non-condensing
Weight
100 g
Table 2-1 : Technical Specification