GE866-QUAD Hardware User Guide
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Page 75 of 82
Mod. 0805 2011-07 Rev.2
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
The GE866 module withstands one reflow process only
.
WARNING:
The above solder reflow profile represents the typical SAC reflow limits and does not
guarantee adequate adherence of the module to the customer application throughout
the temperature range. Customer must optimize the reflow profile depending on the
overall system taking into account such factors as thermal mass and warpage
.