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GE866-QUAD Hardware User Guide
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Page 73 of 82
Mod. 0805 2011-07 Rev.2
the wettability of tin-lead solder paste on the described surface plating is better
compared to lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested
to use milled contours and predrilled board breakouts; scoring or v-cut solutions are
not recommended.
13.7.
Solder paste
Lead free
Solder paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of
the modules after assembly.