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GE866-QUAD Hardware User Guide
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Page 74 of 82
Mod. 0805 2011-07 Rev.2
13.8.
GE866 Solder reflow
Recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
–
Temperature Min (Tsmin)
–
Temperature Max (Tsmax)
–
Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
–
Ramp-up Rate
3°C/second max
Time maintained above:
–
Temperature (TL)
–
Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C