GE866-QUAD Hardware User Guide
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Page 72 of 82
Mod. 0805 2011-07 Rev.2
13.6.
Recommendations for PCB pad dimensions (mm):
It is not recommended to place via or micro-via not covered by solder resist in an
area of 0.3 mm around the pads unless it carries the same signal of the pad itself
(see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni / Immersion Au
3
–
7 / 0.03
–
0.15
Good solderability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the
lead-free process. This issue should be discussed with the PCB-supplier. Generally,
Inhibit area for micro-via