Tektronix TLA Series, Руководство по обслуживанию

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Table of Contents
TLA Series Digitizing Oscilloscope Modules Service Manual
iii
List of Figures
Figure 2--1: Logical address switches 2--2 . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 2--2: Module retainer screws and ejector mechanism 2--3 . . . . . .
Figure 2--3: Digitizing oscilloscope front panel 2--6 . . . . . . . . . . . . . . . . . .
Figure 2--4: Typical system window 2--8 . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 4--1: Calibration/certification procedure flow chart 4--2 . . . . . . .
Figure 4--2: Calibration and Diagnostics property sheet 4--5 . . . . . . . . . .
Figure 4--3: Initial setup for the DC gain accuracy test 4--14 . . . . . . . . . . .
Figure 4--4: Initial setup for the analog bandwidth test 4--16 . . . . . . . . . . .
Figure 4--5: Using a power meter to monitor the amplitude of the
sine wave generator during the analog bandwidth test 4--17 . . . . . . . .
Figure 4--6: Initial setup for the delay between channels test 4--19 . . . . . .
Figure 4--7: Initial setup for the timebase accuracy test 4--20 . . . . . . . . . .
Figure 4--8: Initial setup for the main trigger accuracy test 4--22 . . . . . . .
Figure 4--9: Initial setup for the main trigger sensitivity test 4--23 . . . . . .
Figure 4--10: Initial setup for the probe compensation test 4--24 . . . . . . . .
Figure 5--1: Initial setup for the base calibration adjustment 5--6 . . . . . .
Figure 5--2: Initial setup for the frequency response adjustment 5--8 . . .
Figure 5--3: Using a power meter to monitor the amplitude of the
sine wave generator during the frequency response adjustment 5--9
Figure 5--4: Initial setup for the channel-to-channel skew adjustment 5--12
Figure 5--5: Initial setup for the probe compensation test 5--13 . . . . . . . . .
Figure 6--1: Injector/ejector handle replacement 6--9 . . . . . . . . . . . . . . . .
Figure 6--2: Cover removal 6--10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--3: Seating the cover on the chassis 6--12 . . . . . . . . . . . . . . . . . . . .
Figure 6--4: Processor board removal 6--14 . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--5: Inserting processor board tab into front subpanel 6--15 . . . .
Figure 6--6: BNC replacement 6--16 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--7: Fuse replacement 6--18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--8: Probe interface replacement 6--20 . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--9: Acquisition board replacement 6--22 . . . . . . . . . . . . . . . . . . . .
Figure 6--10: Rear EMI gasket removal 6--23 . . . . . . . . . . . . . . . . . . . . . . . .
Figure 6--11: Rear EMI gasket replacement 6--24 . . . . . . . . . . . . . . . . . . . .