![Tektronix 2213 Скачать руководство пользователя страница 97](http://html.mh-extra.com/html/tektronix/2213/2213_instruction-manual_1078827097.webp)
Maintenance—2213 Service
SOLDERING TECHNIQUES
The reliability and accuracy o f this instrument can
be maintained only if proper soldering techniques are
used to remove or replace parts. General soldering
techniques, which apply to maintenance o f any precision
electronic equipment, should be used when working on this
instrument.
W A R M I N G
To avoid an electric-shock hazard, observe the fo llo w
ing precautions before attem pting any soldering:
turn the instrument o ff, disconnect i t from the ac
pow er source, and a llow approximately three minutes
fo r the power-supply capacitors to discharge.
Use rosin-core wire solder containing 63% tin and 37%
lead. Contact your local Tektronix Field Office or repre
sentative to obtain the names o f approved solder types.
When soldering on circuit boards or small insulated
wires, use only a 15-watt, pencil-type soldering iron. A
higher wattage soldering iron can cause etched circuit
conductors to separate from the board base material and
melt the insulation on small wires. Always keep the
soldering-iron tip properly tinned to ensure best heat trans
fer from the iron tip to the solder joint. To protect heat-
sensitive components, either hold the component lead with
long-nose pliers or place a heat block between the com
ponent body and the solder join t. A pply only enough
solder to make a firm joint. A fter soldering, clean the area
around the solder connection w ith an approved flux-
removing solvent (such as isopropyl alcohol) and allow it to
air dry.
Attem pts to unsolder, remove, and resolder leads
from the component side o f a c ircu it board may
cause damage to the reverse side o f the c irc u it board.
The follow ing techniques should be used to replace a
component on any o f the circu it boards:
1.
Touch the vacuum desoldering tool to the lead at
the solder connection. Never place the iron directly on the
board; doing this may damage the board.
NOTE
Some components are d iffic u lt to remove from the
circu it board due to a bend placed in each lead during
machine insertion o f the component. The purpose o f
the bent leads is to h o ld the component in place
during a solder-flow manufacturing process that
solders a ll the components a t once. To make removal
o f machine-inserted components easier, straighten
the component leads on the reverse side o f the circu it
board w ith a small screwdriver o r pliers, i t may be
necessary to remove the circu it board to gain access
to the component leads on the reverse side o f the
circu it board. Circuit-board removal and reinstallation
procedures are discussed later in this section.
2.
When removing a m ultipin component, especially an
1C, do not heat adjacent pins consecutively. Apply heat to
pins at alternate sides and ends o f the 1C as solder is
removed. A llow a moment fo r the circu it board to cool
before proceeding to the next pin.
Excessive heat can cause the etched circu it con
ductors to separate from the circu it board. Never
allow the solder extractor tip to remain a t one place
on the board fo r more than three seconds. Solder
wick, spring-actuated o r squeeze-bulb solder suckers,
and heat blocks (fo r desoldering m u ltip in com
ponents) must n o t be used. Damage caused b y p oo r
soldering techniques can
void the instrument
warranty.
3.
To replace the component, bend the leads o f the
replacement item to f i t the holes in the circuit board. If the
component is replaced while the board is installed in the
instrument, cut the leads so they protrude only a small
amount through the reverse side o f the circuit board.
Excess lead length may cause shorting to other conductive
parts.
4.
Insert the leads into the holes o f the board so that
the replacement component is positioned the same as the
original component. Most components should be firm ly
seated against the c ircu it board.
5.
Touch the soldering iron to the connection and apply
enough solder to make a firm solder join t. Do not move the
component while the solder hardens.
6.
Cut o ff any excess lead protruding through the circuit
board (if not clipped to size in step 3).
6-12
@
Содержание 2213
Страница 1: ...Ttektronix 2213 OSCILLOSCOPE SERVICE IN S T R U C T IO N M A N U A L ...
Страница 9: ...2213 Service 3827 01 viii The 2213 Oscilloscope ...
Страница 30: ...Theory of Operation 2213 Service 3 3 Figure 3 1 Basic block diagram of the 2213 Oscilloscope ...
Страница 67: ...Adjustment Procedure 2213 Service 5 2 ...
Страница 139: ...Figure 9 4 2213 block diagram S105 ...
Страница 140: ...a o m 7 x C O o z CHANNEL SWITCH AND VERTICAL OUTPUT ...
Страница 141: ...2213 Service ...
Страница 144: ...2213 ...
Страница 146: ...2213 3827 20 R V FB 4982 C 4 ...
Страница 147: ...S90I 4 5 ...
Страница 148: ...CIRCUIT BOARD INTERCONNECTIONS K tv ra n m CIRCUIT BO ARD IN T E R C O N N E C T IO N S ...
Страница 151: ......
Страница 153: ...2213 3 K T i RtV D E C ...
Страница 154: ......
Страница 155: ...2213 Service 1 3 a 7 ...
Страница 161: ...2213 Service n 3 a ...
Страница 168: ...s RE 2213 ...
Страница 169: ... CH 1 CH 2 VERTICAL PREAMPS ...
Страница 175: ......
Страница 177: ...TRIGGER ...
Страница 180: ...fr ...
Страница 181: ...f E V AUG I98Z SWEEP GENERATOR LOGIC ...
Страница 184: ......
Страница 188: ...2 2 1 3 lAlO FWTW m ain b o a rd ...
Страница 190: ...i _____H M N XY AMPLIFIER HORIZ OUTPUT ...
Страница 191: ...A 1 1 C 1 a i F 1 G 1 H 1 3 4 5 6 7 HO COM TO P 4 C C O 5 S I i S2T 2e R EV Dec I9BI 2 2 3 ...
Страница 203: ...2 2 1 3 Service R887 ASTIG R870 GEOM C784 5ns TIMING R860 GRID BIAS ...
Страница 207: ... ...
Страница 216: ...I ...
Страница 217: ...2213 OSCILLOSCOPE ...
Страница 218: ......
Страница 219: ...2213 OSrs ...
Страница 225: ......