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Maintenance-2213 Service
Table 6-4
Maintenance Aids
Description
Specifications
Usage
Example
1. Soldering Iron
15 to 25 W.
General soldering and
unsoldering.
Antex Precision Model C.
2. Torx Screwdrivers
Torx tips #T7, # T8, #T9,
# T 15 and #T20.
Assembly and disassembly.
Tektronix Part Numbers
#T7) 003-1293-00
# T 8 ) 003-0964-00
#T9) 003-0965-00
#T15) 003-0966-00
#T20) 003-0866-00
3. Nutdrivers
1/4 inch, 9/32 inch, 5/16
inch, 1/2 inch, and 9/16 inch.
Assembly and disassembly.
Xcelite #8, #9, #10, #16,
and #18.
4. Open-end Wrenches
1/4 inch, 7/16 inch, 1/2 inch,
9/16 inch, and 5/8 inch.
Assembly and disassembly.
5. Allen Wrenches
0.050 inch and 1/16 inch..
Assembly and disassembly.
6. Long-nose Pliers
Component removal and
replacement.
7. Diagonal Cutters
Component removal and
replacement.
8. Vacuum Solder
Extractor
No static charge retention.
Unsoldering components.
Pace Model PC-10.
9. Lubricant
No-Noise.
Switch lubrication.
Tektronix Part Number
006-0442-02.
10. Pin-replacement K it
Replace circu it board
connector pins.
Tektronix Part Number
040-0542-00.
TRANSISTORS AND
INTEGRATED CIRCUITS
Transistors and integrated circuits should not be
replaced unless they are actually defective. If unsoldered
from the circuit board during routine maintenance, return
them to their original board locations. Unnecessary replace
ment or transposing o f semiconductor devices may affect
the adjustment o f the instrument. When a semiconductor is
replaced, check the performance o f any instrument circuit
that may be affected.
Any replacement component should be o f the original
type or a direct replacement. Bend transistor leads to f it
their circuit board holes and cut the leads to the same
length as the original component. See Figure 9-2 fo r typical
lead-configuration illustrations.
To remove a soldered dual-in-line packaged (DIP) 1C, do
not heat adjacent conductors consecutively. A pply heat to
pins at alternate sides and ends o f the 1C as solder is
removed. A llow a moment fo r the circuit board to cool
before proceeding to the next pin.
The heat-sink-mounted power supply transistors are
insulated from the heat sink. In addition, a heat-sink
compound is used to increase heat transfer capabilities.
Reinstall the insulators and replace the heat-sink compound
when replacing these transistors. The compound should be
applied to both sides o f the insulators and should be
applied to the bottom side o f the transistor where it comes
in contact w ith the insulator.
NOTE
A fte r replacing a pow er transistor, check that the
collector is n o t shorted to the heat sink before
applying power to the instrument.
REV NOV 1981
6-11
Содержание 2213
Страница 1: ...Ttektronix 2213 OSCILLOSCOPE SERVICE IN S T R U C T IO N M A N U A L ...
Страница 9: ...2213 Service 3827 01 viii The 2213 Oscilloscope ...
Страница 30: ...Theory of Operation 2213 Service 3 3 Figure 3 1 Basic block diagram of the 2213 Oscilloscope ...
Страница 67: ...Adjustment Procedure 2213 Service 5 2 ...
Страница 139: ...Figure 9 4 2213 block diagram S105 ...
Страница 140: ...a o m 7 x C O o z CHANNEL SWITCH AND VERTICAL OUTPUT ...
Страница 141: ...2213 Service ...
Страница 144: ...2213 ...
Страница 146: ...2213 3827 20 R V FB 4982 C 4 ...
Страница 147: ...S90I 4 5 ...
Страница 148: ...CIRCUIT BOARD INTERCONNECTIONS K tv ra n m CIRCUIT BO ARD IN T E R C O N N E C T IO N S ...
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Страница 153: ...2213 3 K T i RtV D E C ...
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Страница 161: ...2213 Service n 3 a ...
Страница 168: ...s RE 2213 ...
Страница 169: ... CH 1 CH 2 VERTICAL PREAMPS ...
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Страница 177: ...TRIGGER ...
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Страница 181: ...f E V AUG I98Z SWEEP GENERATOR LOGIC ...
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Страница 190: ...i _____H M N XY AMPLIFIER HORIZ OUTPUT ...
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Страница 203: ...2 2 1 3 Service R887 ASTIG R870 GEOM C784 5ns TIMING R860 GRID BIAS ...
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