Sony HVR-M10C, Руководство по обслуживанию

Страница: 188 / 329

6-45
HVR-M10C/M10E/M10J/M10N/M10P/M10U
1. Removal procedure
1) Remove the soldering at the two locations
1
and remove the
FP-228 flexible board (DEW SENSOR) 2 .
2) Remove the FP-467 flexible board
3
from the mechanical
chassis in the direction of the arrow.
2. Attachment procedure
1) Match the phase of the two holes
A
of the FP-467 flexible
board 3 with the holes of the mechanical chassis, and attach
them each other.
2) Attach the FP-228 flexible board (DEW SENSOR)
2
to the
FP-467 flexible board
3
.
3) Connect the terminals at the two locations
1
by soldering.
1-3-34. FP-228 Flexible Board (DEW SENSOR) and FP-467 Flexible Board
1
Remove the soldering
at the two locations
3
FP-467 flexible board
FP-467
flexible board
Mechanical chassis
Two holes
A
2
FP-228 flexible board
(DEW SENSOR)
Lead-free solder
FP-467 FLEXIBLE BOARD
Bending the flexible board
at the two locations
Temperature of the soldering iron tip: 350
°
C
Contacting time of soldering iron tip: within 2 sec.
• Be careful not to create the hollow soldering, Br,
and there must be no lacking of parts. There must
not be solder ball.
• Be careful not to contact the soldering iron tip too
long time.
• Be careful not to break the flexible board to have
open circuit when installing and removing it.
• Be careful that flexible board must not override
on anything.
• Be careful that the two bending portions of the
FP-467 flexible board must not be bent excessively
that results in open circuit and breakdown of
flexible board.
• Do not rub the DEW sensor with any rubbing bars.
Key Points in Re-assembling
Points to be noted Points to be noted
Soldering