HCD-X10
52
52
HCD-X10
B
E
B
E
C
C
B
E B
E
B
E
B
E
B
E B
E
C
C
C
C
C
C
B
E
B
C
C
E
B
C
E
1
2
15
14
19
1
18
2
R405
R406 R407
R408
R409
R410
R411
R412
R413
R414
R415
CN401
R423
R424
R425
R426
R428 R429
R430
R436
C411
C413
C418
C420
C421
C422
C423
C428
C429
C430
C436
C437
Q300
Q301
D400
IC400
IC402
R306
R307
R314
R316
R318
CN301
R320
R334
R335
C303
C304
C324
Q400 Q401
Q402
Q403
Q404 Q405
Q407
Q408
IC302
1-872-742-
11
(11)
AV-002 BOARD
(COMPONENT SIDE)
A
B
C
D
E
1
2
3
4
5
6
7
(TYPE-11)
(TYPE-12)
(TYPE-11)
(TYPE-12)
6-27. PRINTED WIRING BOARD – AV-002 Board (Component Side) (AEP and UK models) –
: Uses unleaded solder.
•
See page 32 for Circuit Boards Location.
•
Semiconductor
Location
Ref. No. Location
D400
B-4
IC301
C-6
IC302
C-6
IC400
C-4
IC401
C-4
IC402
D-3
IC403
C-3
Q300
C-7
Q301
C-7
Q400
B-4
Q401
B-5
Q402
B-4
Q403
B-4
Q404
B-5
Q405
B-5
Q406
C-3
Q407
C-3
Q408
D-5
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9
9
2
8
9
4
2
9
8
T E L
1 3 9 4 2 2 9 6 5 1 3
8
9
4
8
0
5
1
5
1
3
6
7
3
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299