HCD-X10
48
48
HCD-X10
B
E
B
E
C
C
1
5
1
2
17
16
1
2
17
16
B
C
E
R402
R408
R409
R410 R411
R413
R414
R415
R416
R417
CN400
R421
R422
R423
R424
R425
C402
C409
C413
C415
C417
C418
C419
C424
C425
Q300
Q301
Q302
IC400
FB302
R309
R310
R311
R312
R313
R314
R315
CN301
R323
R325
R327
R329
R331
R333
R339
C303
C304
R341
C305
C306
R342
C307
R343
C308
C322
C324
C327
C330
IC300
IC302
1-872-741-
11
(11)
AV-001 BOARD
(COMPONENT SIDE)
A
B
C
D
F
1
2
3
4
5
6
7
(TYPE-11)
(TYPE-12)
(TYPE-11)
(TYPE-12)
6-23. PRINTED WIRING BOARD – AV-001 Board (Component Side) (US and Canadian models) –
: Uses unleaded solder.
•
See page 32 for Circuit Boards Location.
•
Semiconductor
Location
Ref. No. Location
IC300
C-1
IC301
D-6
IC302
E-6
IC400
C-4
IC401
C-3
IC402
E-4
Q300
D-7
Q301
D-7
Q302
C-1
w w w . x i a o y u 1 6 3 . c o m
Q Q 3 7 6 3 1 5 1 5 0
9
9
2
8
9
4
2
9
8
T E L
1 3 9 4 2 2 9 6 5 1 3
9
9
2
8
9
4
2
9
8
0
5
1
5
1
3
6
7
Q
Q
TEL 13942296513 QQ 376315150 892498299
TEL 13942296513 QQ 376315150 892498299