S i M 3 L 1 x x
30
Rev 1.1
3.2. Thermal Conditions
Table
3.17.
Thermal Conditions
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Thermal Resistance*
JA
TQFP-80 Packages
—
40
—
°C/W
QFN-64 Packages
—
25
—
°C/W
TQFP-64 Packages
—
30
—
°C/W
QFN-40 Packages
—
30
—
°C/W
*Note:
Thermal resistance assumes a multi-layer PCB with the exposed pad soldered to a topside PCB pad.
Содержание SiM3L1xx
Страница 2: ...2 Rev 1 1 ...
Страница 55: ...SiM3L1xx Rev 1 1 55 6 Pin Definitions 6 1 SiM3L1x7 Pin Definitions Figure 6 1 SiM3L1x7 GQ Pinout ...
Страница 62: ...SiM3L1xx 62 Rev 1 1 6 2 SiM3L1x6 Pin Definitions Figure 6 2 SiM3L1x6 GQ Pinout ...
Страница 63: ...SiM3L1xx Rev 1 1 63 Figure 6 3 SiM3L1x6 GM Pinout ...
Страница 69: ...SiM3L1xx Rev 1 1 69 6 3 SiM3L1x4 Pin Definitions Figure 6 4 SiM3L1x4 GM Pinout ...
Страница 74: ...SiM3L1xx 74 Rev 1 1 6 4 TQFP 80 Package Specifications Figure 6 5 TQFP 80 Package Drawing ...
Страница 81: ...SiM3L1xx Rev 1 1 81 6 6 TQFP 64 Package Specifications Figure 6 9 TQFP 64 Package Drawing ...
Страница 89: ...SiM3L1xx Rev 1 1 89 Figure 7 3 SiM3L1x4 GM Revision Information ...