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Semiconductor Group
21
Memory Organization
Using the Stack Pointer (SP) - a special function register described in section 4.4 - the stack can be
located anywhere in the whole internal data memory address space. The stack depth is limited only
by the internal RAM available (256 byte maximum). However, the user has to take care that the
stack is not overwritten by other data, and vice versa.
External Data Memory
Figure 4-2 and 4-3 contain memory maps which illustrate the internal/external data memory. To
address data memory external to the chip, the "MOVX" instructions in combination with the 16-bit
datapointer or an 8-bit general purpose register are used. Refer to chapter 9 (Instruction Set) or 5
(External Bus Interface) for detailed descriptions of these operations. A maximum of 64 Kbytes of
external data memory can be accessed by instructions using 16-bit address.
Figure 4-2
Data Memory / SFR Address Space
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Содержание SAB 80515 Series
Страница 9: ...Semiconductor Group 9 Introduction Figure 1 2 Block Diagram ...
Страница 12: ...Semiconductor Group 12 Fundamental Structure Figure 2 1 Detailed Block Diagram ...
Страница 18: ...Semiconductor Group 18 Central Processing Unit Figure 3 1 Fetch Execute Sequence ...
Страница 22: ...Semiconductor Group 22 Memory Organization Figure 4 3 Mapping of the Lower Portion of the Internal Data Memory ...
Страница 30: ...Semiconductor Group 30 External Bus Interface Figure 5 1 a and b External Program Memory Execution ...
Страница 38: ...Semiconductor Group 38 On Chip Peripheral Components Figure 7 3 Output Driver Circuits of Ports 1 through 5 ...
Страница 59: ...Semiconductor Group 59 On Chip Peripheral Components Figure 7 16 a Functional Diagram Serial Interface Mode 0 ...
Страница 60: ...Semiconductor Group 60 On Chip Peripheral Components Figure 7 16 b Timing Diagram Serial Interface Mode 0 ...
Страница 61: ...Semiconductor Group 61 On Chip Peripheral Components Figure 7 17 a Functional Diagram Serial Interface Mode 1 ...
Страница 62: ...Semiconductor Group 62 On Chip Peripheral Components Figure 7 17 b Timing Diagram Serial Interface Mode 1 ...
Страница 73: ...Semiconductor Group 73 On Chip Peripheral Components Figure 7 25 A D Converter Block Diagram ...
Страница 83: ...Semiconductor Group 83 On Chip Peripheral Components Figure 7 33 a Timer 2 Block Diagram ...
Страница 111: ...Semiconductor Group 111 On Chip Peripheral Components Figure 7 54 Timing Diagram System Clock Output ...
Страница 113: ...Semiconductor Group 113 Interrupt System Figure 8 1 a Interrupt Structure of the SAB 80 C 515 80 C 535 ...
Страница 114: ...Semiconductor Group 114 Interrupt System Figure 8 1 b Interrupt Structure of the SAB 80 C 515 80 C 535 cont d ...
Страница 204: ...Semiconductor Group 204 Instruction Set XCH A Ri Operation XCH A Ri Bytes 1 Cycles 1 Encoding 1 1 0 0 0 1 1 i ...
Страница 215: ...Device Specifications Semiconductor Group 215 ...
Страница 217: ...Device Specifications Semiconductor Group 217 Pin Configuration P LCC 68 ...
Страница 219: ...Device Specifications Semiconductor Group 219 Logic Symbol ...
Страница 226: ...Device Specifications Semiconductor Group 226 Figure 1 Block Diagram ...
Страница 229: ...Device Specifications Semiconductor Group 229 Figure 2 Memory Address Spaces ...
Страница 239: ...Device Specifications Semiconductor Group 239 Figure 4 Block Diagram of the A D Converter ...
Страница 241: ...Device Specifications Semiconductor Group 241 Figure 5 Interrupt Request Sources ...
Страница 242: ...Device Specifications Semiconductor Group 242 Figure 6 Interrupt Priority Level Structure ...
Страница 268: ...Device Specifications Semiconductor Group 268 AC Testing Input Output Waveforms AC Testing Float Waveforms ...