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Semiconductor Group
130
Instruction Set
General-Purpose Transfers
– MOV performs a bit or byte transfer from the source operand to the destination operand.
– PUSH increments the SP register and then transfers a byte from the source operand to the
stack location currently addressed by SP.
– POP transfers a byte operand from the stack location addressed by the SP to the destination
operand and then decrements SP.
Accumulator-Specific Transfers
– XCH exchanges the byte source operand with register A (accumulator).
– XCHD exchanges the low-order nibble of the source operand byte with the low-order nibble
of A.
– MOVX performs a byte move between the external data memory and the accumulator. The
external address can be specified by the DPTR register (16 bit) or the R1 or R0 register (8 bit).
– MOVC moves a byte from program memory to the accumulator. The operand in A is used as
an index into a 256-byte table pointed to by the base register (DPTR or PC). The byte operand
accessed is transferred to the accumulator.
Address-Object Transfer
– MOV DPTR, #data loads 16 bits of immediate data into a pair of destination registers, DPH
and DPL.
9.2.2
Arithmetic
The SAB 80(C)515/80(C)535 has four basic mathematical operations. Only 8-bit operations using
unsigned arithmetic are supported directly. The overflow flag, however, permits the addition and
subtraction operation to serve for both unsigned and signed binary integers. Arithmetic can also be
performed directly on packed BCD representations.
Addition
– INC (increment) adds one to the source operand and puts the result in the operand.
– ADD adds A to the source operand and returns the result to A.
– ADDC (add with carry) adds A and the source operand, then adds one (1) if CY is set, and
puts the result in A.
– DA (decimal-add-adjust for BCD addition) corrects the sum which results from the binary
addition of two-digit decimal operands. The packed decimal sum formed by DA is returned to
A. CY is set if the BCD result is greater than 99; otherwise, it is cleared.
*
Содержание SAB 80515 Series
Страница 9: ...Semiconductor Group 9 Introduction Figure 1 2 Block Diagram ...
Страница 12: ...Semiconductor Group 12 Fundamental Structure Figure 2 1 Detailed Block Diagram ...
Страница 18: ...Semiconductor Group 18 Central Processing Unit Figure 3 1 Fetch Execute Sequence ...
Страница 22: ...Semiconductor Group 22 Memory Organization Figure 4 3 Mapping of the Lower Portion of the Internal Data Memory ...
Страница 30: ...Semiconductor Group 30 External Bus Interface Figure 5 1 a and b External Program Memory Execution ...
Страница 38: ...Semiconductor Group 38 On Chip Peripheral Components Figure 7 3 Output Driver Circuits of Ports 1 through 5 ...
Страница 59: ...Semiconductor Group 59 On Chip Peripheral Components Figure 7 16 a Functional Diagram Serial Interface Mode 0 ...
Страница 60: ...Semiconductor Group 60 On Chip Peripheral Components Figure 7 16 b Timing Diagram Serial Interface Mode 0 ...
Страница 61: ...Semiconductor Group 61 On Chip Peripheral Components Figure 7 17 a Functional Diagram Serial Interface Mode 1 ...
Страница 62: ...Semiconductor Group 62 On Chip Peripheral Components Figure 7 17 b Timing Diagram Serial Interface Mode 1 ...
Страница 73: ...Semiconductor Group 73 On Chip Peripheral Components Figure 7 25 A D Converter Block Diagram ...
Страница 83: ...Semiconductor Group 83 On Chip Peripheral Components Figure 7 33 a Timer 2 Block Diagram ...
Страница 111: ...Semiconductor Group 111 On Chip Peripheral Components Figure 7 54 Timing Diagram System Clock Output ...
Страница 113: ...Semiconductor Group 113 Interrupt System Figure 8 1 a Interrupt Structure of the SAB 80 C 515 80 C 535 ...
Страница 114: ...Semiconductor Group 114 Interrupt System Figure 8 1 b Interrupt Structure of the SAB 80 C 515 80 C 535 cont d ...
Страница 204: ...Semiconductor Group 204 Instruction Set XCH A Ri Operation XCH A Ri Bytes 1 Cycles 1 Encoding 1 1 0 0 0 1 1 i ...
Страница 215: ...Device Specifications Semiconductor Group 215 ...
Страница 217: ...Device Specifications Semiconductor Group 217 Pin Configuration P LCC 68 ...
Страница 219: ...Device Specifications Semiconductor Group 219 Logic Symbol ...
Страница 226: ...Device Specifications Semiconductor Group 226 Figure 1 Block Diagram ...
Страница 229: ...Device Specifications Semiconductor Group 229 Figure 2 Memory Address Spaces ...
Страница 239: ...Device Specifications Semiconductor Group 239 Figure 4 Block Diagram of the A D Converter ...
Страница 241: ...Device Specifications Semiconductor Group 241 Figure 5 Interrupt Request Sources ...
Страница 242: ...Device Specifications Semiconductor Group 242 Figure 6 Interrupt Priority Level Structure ...
Страница 268: ...Device Specifications Semiconductor Group 268 AC Testing Input Output Waveforms AC Testing Float Waveforms ...