1 OVeRVieW
S1C17153 TeChniCal Manual
Seiko epson Corporation
1-3
(Rev. 1.0)
Pads
1.3
Pad Configuration Diagram
1.3.1
P03
/EXCL0/LFRO
P04
/TOUTA0/CAPA0
P05
/TOUTB0/CAPB0/#SPISS0
P06
/BZ/SDI0
P07
/#BZ/SDO0
P10
/FOUTB/SPICLK0
P11/BZ P12/#BZ
P13
SEG31 SEG30 SEG29 SEG28
COM0 COM1 COM2 COM3
SEG0 SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7
V
C3
V
C2
V
C1
CB
CA
V
SS
V
DD
V
D1
OSC1
OSC2
TEST
#RESET
P00/SIN0
P01/SOUT0
P02/SCLK0/FOUTA
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
Y
X
(0, 0)
1.952 mm
1.781 mm
1 2 3 4 5 6 7 8 9
10 11 12 13
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
45 44 43 42
41 40 39 38 37 36 35 34
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
Die No.
3.1.1 S1C17153 Pad Configuration Diagram
Figure 1.
Chip size
X = 1.781 mm, Y = 1.952 mm
Pad opening
X = 68 µm, Y = 68 µm
Chip thickness 400 µm