Galaxy Raid GHDX2-2430S-16U4D Installation and Hardware Reference Manual
1-4
Subsystem
Components
1.2.3 Backplane
Board
An integrated backplane board separates the front and rear sections of the
chassis. This backplane provides logic level signals and low voltage power
paths. The backplane also comes with thermal sensors and I
2
C devices to
detect system temperature and the operating status of the PSU/cooling
modules. This board contains no user-serviceable components.
1.2.4 Physical
Dimensions
The GALAXY comes in an enhanced 3U chassis with the following
dimensions:
•
With handles: 482.6mm (W) x 131mm (H) x 504.3mm (L) (19 x
5.2 x 19.8 inches)
•
Without handles: 445mm (W) x 130mm (H) x 488.2mm (L) (17.5 x
5.1 x 19.2 inches)
1.3 Subsystem Components
The subsystem houses many active components and most of them can be
accessed through either the front or rear panel. The modular design of the
active components facilitates installation and removal of these components.
Hot-swap mechanisms are incorporated to eliminate power surges and signal
glitches that might occur while removing or installing these modules. Each
component is further described below:
1.3.1 LCD Keypad Panel
Figure 1-4: LCD Keypad Panel
PN: GAL-9273CHandLLCD
The LCD keypad panel shown in
Figure 1-4
consists of a 2-rows x 16-
characters LCD screen with push buttons and LED status indicators. The
LCD front panel provides full access to all RAID configuration settings and
monitoring functions. After powering up the subsystem, the initial screen
