APPENDIX C CONNECTORS FOR TARGET CONNECTION
User’s Manual U14481EJ3V0UM
78
C.7 Notes on Handling LSPACK/CSSOCKET (FBGA Package)
Caution When mounting CSSOCKET for the first time, refer to C.3 Notes on Board Design (FBGA
Package), and C.4 Soldering CSSOCKET (Main Enclosure Connector) to Target Board (FBGA
Package).
(1) When taking out LSPACK from the case, hold LSPACK and take out the sponge first.
(2) The case may be deformed if it is left for a long time in a location where temperature is 50
°
C or higher. Store it in
a location where it is not subject to direct sunlight, and the temperature is 40
°
C or below.
(3) Protective tape is attached to CSSOCKET for protection from flux splashing during reflow soldering. Do not
remove this tape until reflow soldering is completed.
(4) Recommended reflow conditions
Surface temperature of CSSOCKET
Preheating: 150 to 180
°
C, 180 seconds
Heating:
210
°
C or more, 30 to 60 seconds
(5) Because the construction of CSSOCKET allows flux and cleaning solvent to remain in the connector, do not dip
CSSOCKET into flux or clean it to remove flux. The same applies when using CSSOCKET with other DIP
components, as the flux of the DIP component may get into CSSOCKET.
(6) To secure LSPACK with screws, use a dedicated screwdriver (+) or torque driver to tighten the screws at four
places. The tightening torque should be 0.55 kg
⋅
f
⋅
cm (0.054 Nm) maximum. Do not tighten one screw too much
as it may cause a faulty contact.
(7) After soldering the CSSOCKET, it is recommended to solder the guide pins from the bottom side of the board or
to secure the connector peripheral parts with resin, for reinforcement.
(8) To use CSSOCKET between CSSOCKET and LSPACK for stacking, exercise care that the pins of CSSOCKET
for stacking are not bent.
(9) Use LSPACK/CSSOCKET as connector of evaluation.
(10) LSPACK/CSSOCKET must not be used in an environment subject to constant shock or vibration.
(11) It is assumed that this product is used for development and evaluation in a system. When using this product
domestically, it is not subject to The Electric Appliance and Material Control Law and protection from
electromagnetic interference.