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APPENDIX C CONNECTORS FOR TARGET CONNECTION
User’s Manual U14481EJ3V0UM
72
C.2 Cautions on Handling Connectors (LQFP Package)
(1) When taking connectors out of the case, remove the sponge while holding the main unit.
(2) When soldering the NQPACK144SD or NQPACK100SD to the target system, cover with the HQPACK144SD or
HQPACK100SD to protect it against splashing flux.
Recommended soldering conditions… Reflow:
240
°
C, 20 seconds max.
Partial heating: 240
°
C, 10 seconds max. (per pin row)
(3) Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK144SD
or NQPACK100SD. Moreover, check that the hold pins of the HQPACK144SD or HQPACK100SD are not broken
or bent before mounting the HQPACK144SD or HQPACK100SD. If there are broken or bent pins, fix them with a
thin, flat plate such as a blade.
(4) When securing the YQPACK144SD or YQPACK100SD (connector for emulator connection) or HQPACK144SD or
HQPACK100SD to the NQPACK144SD or NQPACK100SD with screws, tighten the four screws temporarily with
the screwdriver provided or a driver with a torque gauge, then tighten the screws in a crisscross pattern (with
0.054 Nm max. torque).
Excessive tightening of only one screw may diminish conductivity.
If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and check that the
NQPACK144SD or NQPACK100SD is not dirty and make sure the device pins are parallel.
(5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD or NQPACK100SD may
cause pins to bend. When mounting a device on NQPACK144SD or NQPACK100SD, check and adjust bent
pins.