User’s Manual U14481EJ3V0UM
70
APPENDIX C CONNECTORS FOR TARGET CONNECTION
C.1 Usage (LQFP Package)
(1) When mounting NQPACK144SD on target system
<1> Coat the tip of the four projections (points) at the bottom of the NQPACK144SD or NQPACK100SD with
two-component type epoxy adhesive (cure time longer than 30 minutes) and bond the NQPACK144SD or
NQPACK100SD to the target system. If not bonded properly, the pad of the printed circuit board may peel
off when the emulator is removed from the target system. If the lead of the NQPACK144SD or
NQPACK100SD is not aligned with the pad of the target system easily, perform step <2> to adjust the
position.
<2> To adjust the position, insert the guide pins for position-adjustment (NQGUIDE) provided with the
NQPACK144SD or NQPACK100SD into the pin holes at the upper side of NQPACK144SD or
NQPACK100SD (refer to
Figure C-1
). The diameter of a hole is
φ
= 1.0 mm. There are three non-through
holes (refer to
APPENDIX A DIMENSIONS
).
<3> After setting the HQPACK144SD or HQPACK100SD, solder the NQPACK144SD or NQPACK100SD to the
target system. By following this sequence, adherence of flux or solder sputtering to contact pins of the
NQPACK144SD or NQPACK100SD can be avoided.
Recommended soldering conditions… Reflow:
240
°
C, 20 seconds max.
Partial heating:
240
°
C, 10 seconds max. (per pin row)
<4> Remove the guide pins.
Figure C-1. Mounting of NQPACK144SD or NQPACK100SD
NQPACK144SD or NQPACK100SD
Guide pins
(NQGUIDE)
HQPACK144SD or HQPACK100SD
Target system
Remark
NQPACK144SD or NQPACK100SD: Connector for target connection
HQPACK144SD or HQPACK100SD: Cover for device mounting