Rev. 1.00, 09/03, page 671 of 704
Item
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
V
CC
– 0.5
I
OH
= –200 µA
All output pins (except for
P80 to P83, PC0 to PC3)
V
CC
– 1.0
I
OH
= –1 mA
Output high
voltage
P80 to P83, PC0 to PC3
*
2
V
OH
0.5
I
OH
= –200 µA
SCL3, SCL2, SCL1,
SCL0, SDA3, SDA2,
SDA1, SDA0
0.4
I
OL
= 3 mA
Output low
voltage
Output pins other than
above
V
OL
0.4
I
OL
= 1.6 mA
STBY
, NMI,
RES
, MD0 to
MD2, FWE
I
in
1.0 µA V
in
= 0.5 to V
CC
– 0.5 V
Input leakage
current
Ports 0 and 7
1.0
V
in
= 0.5 to AV
CC
– 0.5 V
Ports 1 to 6,
ports 84 to 87,
ports 9, A to D
I
TSI
1.0
V
in
= 0.5 to V
CC
– 0.5 V
Three-state
leakage
current (off
state)
Ports 80 to 83,
ports C0 to C3
1.0
V
in
= 0.5 to 5.5 V
Input pull-up
MOS current
Ports 1 to 3, 6
–I
P
5
150
V
in
= 0 V
All input pins
(except for P80 toP83,
PC0 to PC3)
C
in
10 pF
Input
capacitance
P80 to P83, PC0 to PC3
10
V
in
= 0 V
f = 1 MHz
Ta = 25
°
C
Normal operation
*
5
23
35
V
CC
= 3.0 V to 3.6 V
f = 20 MHz, when all
module stop cleared, high-
speed mode
Sleep mode
15
25
mA
V
CC
= 3.0 V to 3.6 V
f = 20 MHz
90
Ta
≤
50°C
Current
consumption
*
3
Standby mode
*
4
I
CC
120
µA
50°C < Ta
During A/D conversion
AI
cc
2.0 mA
Analog power
supply current
A/D conversion standby
5.0
µ
A AV
CC
= 2.0 V to 3.6 V
During A/D conversion
AI
ref
1.0 mA
Reference
power supply
current
A/D conversion standby
5.0
µ
A AV
ref
= 2.0 V to 3.6 V
RAM standby voltage
*
4
V
RAM
2.0
V
Содержание H8S/2437
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