M50 Hardware Design
M50_HD_V2.0
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7.2. Soldering
The squeegee should push the paste on the surface of the stencil that makes the paste fill the
stencil openings and penetrate to the PCB. The force on the squeegee should be adjusted so as to
produce a clean stencil surface on a single pass. To ensure the module soldering quality, the
thickness of stencil at the hole of the module pads should be 0.2mm for M50 .
Figure 56: Paste application
Suggest peak reflow temperature is from 235
℃
to 245
℃
(for SnAg3.0Cu0.5 alloy). Absolute
max reflow temperature is 260
℃
. To avoid damage to the module when it was repeatedly heated,
it is suggested that the module should be mounted after the first panel has been reflowed. The
following picture is the actual diagram which we have operated.
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