LTE Module Series
EG95 Hardware Design
EG95_Hardware_Design 72 / 81
8
Storage, Manufacturing and
Packaging
8.1.
Storage
EG95 is stored in a vacuum-sealed bag. The storage restrictions are shown as below.
1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC/90%RH.
2. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other
high temperature processes must be:
Mounted within 168 hours at the factory environment of
≤30ºC/60%RH.
Stored at <10%RH.
3. Devices require baking before mounting, if any circumstance below occurs.
When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity
is >10% before opening the vacuum-sealed bag.
Device mounting cannot be finished within 168 hours at factory conditions of
≤30ºC/60%RH.
4. If baking is required, devices may be baked for 8 hours at 120ºC±5ºC.
As the plastic package cannot be subjected to high temperature, it should be removed from devices
before high temperature (120ºC) baking. If shorter baking time is desired, please refer to
IPC/JEDECJ-STD-033
for baking procedure.
NOTE
