LTE Module Series
EG95 Hardware Design
EG95_Hardware_Design 67 / 81
Thermal Pad
Heatsink
Application Board
Application Board
Heatsink
Thermal Pad
EG95 Module
Shielding Cover
Figure 40: Referenced Heatsink Design (H
eatsink at the Bottom of Customers’ PCB)
The module offers the best performance when the internal BB chip stays below 105°C. When the
maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides
reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip
temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to
network connected state after the maximum temperature falls below 115°C. Therefore, the thermal design
should be maximally optimized to make sure the maximum BB chip temperature always maintains below
105°C.
Customers can execute
AT+QTEMP
command and get the maximum BB chip temperature from
the first returned value.
NOTE