LTE Module Series
EG95 Hardware Design
EG95_Hardware_Design 16 / 81
3
Application Interfaces
3.1.
General Description
EG95 is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin
ground/reserved pads that can be
connected to customers
’ cellular application platforms. Sub-interfaces included in these pads are
described in detail in the following chapters:
Power supply
(U)SIM interfaces
USB interface
UART interfaces
PCM and I2C interfaces
SPI interface
Status indication