EN 8
3139 785 32540
2.1 Lead Free Requirements
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
one must treat all sets from
1 Jan 2005
onwards, according next
rules:
Important note: In fact also products of year 2004 must be treated in
this way as long as you avoid mixing solder-alloys (leaded/ lead-free).
So best to always use SAC305 and the higher temperatures belong
to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
•
Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-paste is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
•
Use only adequate solder tools applicable for lead-free solder
alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
•
Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint. Heating-
time of the solder-joint should not exceed ~ 4 sec. Avoid
temperatures above 400°C otherwise wear-out of tips will rise
drastically and
fl
ux-
fl
uid will be destroyed. To avoid wear-out
of tips switch off un-used equipment, or reduce heat.
•
Mix of lead-free solder alloy / parts with leaded solder alloy /
parts is possible but PHILIPS recommends strongly to avoid
mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is lead-
free, clean carefully the solder-joint from old solder alloy and
re-solder with new solder alloy (SAC305).
•
Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
•
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
pro
fi
le of the speci
fi
c BGA (for de-soldering always use the
lead-free temperature pro
fi
le, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to protect
the IC against moisture. After opening, dependent of MSL-
level seen on indicator-label in the bag, the BGA-IC possibly
still has to be baked dry. (MSL=Moisture Sensitivity Level).
This will be communicated via AYS-website.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products of 2004),
containing leaded solder-alloy and components, all needed
spare-parts will be available till the end of the service-period.
For repair of such sets nothing changes.
•
On our website
www.atyourservice.ce.Philips.com
you
fi
nd
more information to:
BGA-de-/soldering (+ baking instructions)
Heating-pro
fi
les of BGAs and other ICs used in
Philips-sets
You
will
fi
nd this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
2.
Measurements Setup, Service Aid & Lead Free Requirements
