NXP Semiconductors
UM11108
FRDM-GD3100EVM half-bridge evaluation board
UM11108
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User guide
Rev. 3.0 — 16 August 2018
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Test point
Definitions
VREFL
5.0 V reference test point for isolated analog circuitry on low-side driver
FSISOL
Fail-safe state management test point for low-side driver domain
TSENSEAL
Temperature sense test point connected to anode of IGBT temp sense diode and
MC33GD3100 TSENSEA input of low-side driver
GNDL1
Low-side driver ground point
GNDL2
Low-side driver ground point
AMXGNDL
Isolated ground test point for AMUXIN of MC33GD3100 low-side driver
GL
IGBT gate test point on low-side driver domain which is the charging pin of IGBT
gate
SL
ISENSE test point connected to IGBT current sense and MC33GD3100 low-side
driver ISENSE pin
High-side driver domain
VCCH
Positive voltage supply test point for isolated circuitry and high-side driver gate of
IGBT
CLAMPH
V
CE
sense test point connected to high-side driver clamp pin and circuitry
DSTH
V
CE
desaturation test point connected to high-side driver DESAT pin and circuitry
VEEH
Negative voltage supply test point for high-side driver gate of IGBT
AMXH
Analog MUX input test point for high-side driver
VREFH
5.0 V reference test point for isolated analog circuitry on high-side driver
FSISOH
Fail-safe state management test point for high-side driver domain
GNDH1
High-side driver ground point
GNDH2
High-side driver ground point
AMXGNDH
Isolated ground test point for AMUXIN of MC33GD3100 high-side driver
GH
IGBT gate test point on high-side driver domain which is the charging pin of IGBT
gate
SH
ISENSE test point connected to IGBT current sense and MC33GD3100 high-side
driver ISENSE pin
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