1035
User’s Manual U16580EE3V1UD00
Chapter 27
Recommended Soldering Conditions
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor
Device:
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended please consult NEC.
Note:
After that, prebaking is necessary at tbd °C for tbd hours.
The number of days refers to storage at 25°C, 65% RH MAX after the dry pack has been
opened.
Caution:
Do not use two or more soldering methods in combination (except partial heating
method).
Table 27-1:
Soldering Conditions
Soldering Method
Soldering Condition
Symbol of Recommended Soldering
Condition
Infrared reflow
Package peak temperature: tbd °C,
Time: tbd seconds max. (tbd °C min.),
Number of times: tbd max.,
Number of days: tbd
Note
tbd
VPS
Package peak temperature: tbd °C,
Time: tbd seconds max. (tbd°C min.),
Number of times: tbd max.,
Number of days: tbd
Note
tbd
Partial heating
Pin temperature: tbd °C max.,
Time: tbd seconds max. (per side of device)
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Содержание MuPD70F3187
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Страница 192: ...192 Chapter 5 Memory Access Control Function μPD70F3187 only User s Manual U16580EE3V1UD00 MEMO ...
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Страница 534: ...534 Chapter 11 16 bit Timer Event Counter T User s Manual U16580EE3V1UD00 ...
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Страница 976: ...976 Chapter 22 Internal RAM Parity Check Function User s Manual U16580EE3V1UD00 MEMO ...
Страница 984: ...984 Chapter 23 On Chip Debug Function OCD User s Manual U16580EE3V1UD00 MEMO ...
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